Senju Metal Industry to Showcase 'Engineering Method Proposals' Integrating Equipment and Materials at JISSO PROTEC 2026

Senju Metal Industry Co., Ltd. (Headquarters: Adachi-ku, Tokyo; President: Ryoichi Suzuki), a global developer and manufacturer of metal materials and equipment for the electronics sector—centered on soldering solutions—will exhibit at JISSO PROTEC 2026, held over three days from June 10 (Wed) to June 12 (Fri), 2026, at Tokyo Big Sight.

In this exhibition, the company will go beyond introducing individual products to propose assembly methods that account for the entire mounting process by combining equipment and materials.

JISSO PROTEC is a comprehensive exhibition for electronic component mounting technology where cutting-edge technologies that support the electronics society gather. It attracts significant interest as a venue where many engineers and researchers involved in assembly visit for technical consideration and business negotiations for actual implementation.

With the theme 'Implementing the potential of manufacturing into the future society,' the company will exhibit with a focus on 'engineering method proposals' combining equipment and materials. By utilizing its comprehensive technology that spans equipment, processes, and analysis, in addition to the material expertise cultivated as a solder manufacturer, the company aims to offer practical approaches to the challenges faced on the assembly floor.

Main Exhibition Highlights

● Proposals considering the entire mounting process Equipment will be presented as a set with recommended materials, proposing assembly methods rather than just individual products. This allows visitors to grasp application images and key points for implementation while comparing them with their own processes and challenges.

Through this configuration, the exhibition booth will expand from a place to 'view products' to a place to 'discuss assembly methods.' Presentations to deepen understanding will also be conducted at each corner.

● Lineup of eco-friendly solder materials In the materials field, the company will present a lineup centered on eco-friendly general-purpose materials, aiming to balance environmental compliance with stable assembly quality. Based on the requirements of the mounting floor, such as 'ease of use,' 'high yield,' and 'stable procurement,' the company will also explain the approach to selecting materials applicable to daily production.

● Low-temperature solder solution 'MILATERA' With the recent rise in metal prices and the increase in devices with large heat capacities, the demand for low-temperature bonding is rising again. 'MILATERA,' a low-temperature solder solution developed by the company, has seen expanded application consideration three years after its release, with movements starting to rethink conventional mounting conditions. At the exhibition, against the backdrop of these market changes, the company will introduce low-temperature bonding as a realistic option, also incorporating the perspective of environmental load reduction.

● Group company corner As an element supporting the technical prowess of the SMIC Group, the company will also exhibit corner displays for group companies, Industry Analysis Center (IAS) and Senju System Technology (SST). IAS, as a third-party organization, responds to analysis requests from various companies and will focus on analysis related to mounting in this exhibition. SST will showcase new equipment along with materials suitable for that equipment, proposing combinations of equipment and materials.

Through these efforts, the SMIC Group will work together to respond to the problems of those involved in assembly from the perspectives of materials, equipment, and analysis.

Exhibition Outline

- Name: The 27th JISSO PROTEC 2026 - Period: June 10 (Wed) – June 12 (Fri), 2026, 10:00–17:00 - Venue: Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo), East Exhibition Hall 1F - Booth Number: 1B-49