Kaijo Co., Ltd. (Hachioji City, Tokyo) has begun sales of the newly developed 'QUAVA mini Mega Puck (Quova Mini Mega Puck),' designed for precision cleaning of wafers, resist stripping, and removal of post-etch residues in semiconductor manufacturing processes. This product is a new type of ultrasonic cleaning system that uses Kaijo's proprietary contact cleaning method to form an ultrasonic liquid film that removes fine contaminants. By applying high-frequency ultrasound (3MHz), it achieves both 'ultra-high cleanliness cleaning' for advanced semiconductors and 'damage-free' cleaning that does not harm circuitry.
Background of Development
In recent years, semiconductor devices have rapidly advanced in performance and miniaturization. As a result, even minor particle adhesion during manufacturing, or microscopic residues remaining after resist stripping and etching, have become critical factors causing circuit shorts and reduced yields. Consequently, there is a stronger demand than ever for higher-level 'high-cleanliness cleaning.'
However, miniaturized circuit patterns are extremely delicate, and conventional high-power ultrasonic cleaning poses a risk of damaging the circuits themselves (e.g., pattern collapse).
To address these conflicting challenges—achieving high cleaning power to completely remove fine contaminants while ensuring damage-free processing for ultra-fine circuits—Kaijo has consolidated its long-standing ultrasonic expertise to develop and launch this product.
Product Features
This ultrasonic cleaner is a new type of ultrasonic cleaning system that uses Kaijo's proprietary contact cleaning method to form an ultrasonic liquid film that removes fine contaminants.
Transducer Structure of the Contact Method
In high-frequency ultrasonic cleaning, the transducer must be placed close to the object being cleaned to stably and efficiently transmit energy. However, if the distance is not optimal, ultrasonic energy attenuates. Therefore, the 'QUAVA mini Mega Puck' incorporates a 'warning signal function (gap indicator function)' in the oscillator. This ensures the optimal distance between the transducer and the object, enabling stable propagation of ultrasonic waves.
Additionally, to accommodate various chemical solutions, transducer plates made of quartz, stainless steel, and sapphire are available. Furthermore, the transducer cooling mechanism stabilizes frequency and enables long-term continuous operation, contributing to the transducer's extended lifespan.
Comparison of Cleaning Methods
The main characteristics of the three primary cleaning methods used in semiconductor manufacturing are as follows:
Comparison of cleaning methods (from left: batch, shower, contact) *Image is illustrative.
Cleaning Method
Features
Batch Method
· Suitable for large-volume batch processing.
· Risk of uneven cleaning and re-adhesion of detached particles due to localized cleaning.
Shower Method
· Extremely low risk of particle re-adhesion due to continuous flow of fresh liquid.
· Difficult to clean the entire surface uniformly due to point-based cleaning; risk of circuit damage from strong impact and centrifugal force caused by high-speed rotation.
Contact Method
· Uniform ultrasonic transmission over a wide effective area eliminates cleaning unevenness.
· Increased contact frequency in deep holes due to low-speed rotation.
Recommended Industries and Target Applications
This product is ideal for the following industries and applications where high cleanliness and damage-free processing are critical.
Recommended Industries:
· Semiconductor device manufacturers (front-end processes)
· Semiconductor manufacturing equipment manufacturers
· Electronic component, optical element, and silicon wafer manufacturers
Main Workpieces and Processes Where the Product Excels:
· Advanced semiconductor wafers (silicon wafers, SiC, GaN, etc.): Simultaneously achieves wide-range particle removal from nano- to micron-scale and precision cleaning of delicate wafers prone to pattern collapse.
· Post-resist stripping and post-etching processes: Promotes ultrasonic-assisted stripping and etching, and completely removes microscopic organic and inorganic residues.
· Photomasks, MEMS, and various optical substrates: Removes contaminants from ultra-precision flat workpieces where scratches are unacceptable.
Product Specifications
QUAVA mini Oscillator Specifications
Model
20110(QA-001)
20110(QD-027)
Maximum Output
1W – 50W
(Output adjustment unit: 0.1W)
1W – 50W
(Output adjustment unit: 0.1W)
Frequency
950kHz, 3MHz
950kHz, 3MHz
(Dual oscillation)
Oscillation Mode
PLL oscillation, A mode
PLL oscillation, A mode
Power Supply
AC100V – AC240V, 250VA
Single-phase 50/60Hz
AC100V – AC240V, 250VA
Single-phase 50/60Hz
Dimensions
218(W)×258(D)×138(H) mm
218(W)×258(D)×138(H) mm
Weight
5kg
5kg
Mega Puck Transducer Specifications
950kHz
Model
28230
28231
Oscillator Model
20110 (QA-001)
20110 (QA-001)
Frequency, Allowable Input
950kHz/50W
950kHz/50W
Housing Material
ECTFE
ECTFE
Transducer Plate Material
Quartz
Sapphire
Operating Liquid Temperature
15–40°C
15–40°C
Liquid Flow Rate
1.0–2.0L/min
1.0–2.0L/min
Air Purge Flow Rate
Approx. 10L/min (below 0.02MPa)
Approx. 10L/min (below 0.02MPa)
Dimensions
65(W)×74(D)×38(H)mm
65(W)×74(D)×38(H)mm
Weight
Approx. 0.4kg
Approx. 0.4kg
3MHz
Model
29230H
29231H
Oscillator Model
20110 (QA-001)
20110 (QA-001)
Frequency, Allowable Input
3MHz/30W
3MHz/30W
Housing Material
ECTFE
ECTFE
Transducer Plate Material
Quartz
Sapphire
Operating Liquid Temperature
15–40°C
15–40°C
Liquid Flow Rate
1.0–2.0L/min
1.0–2.0L/min
Air Purge Flow Rate
Approx. 10L/min (below 0.02MPa)
Approx. 10L/min (below 0.02MPa)
Dimensions
65(W)×74(D)×38(H)mm
65(W)×74(D)×38(H)mm
Weight
Approx. 0.4kg
Approx. 0.4kg
950kHz / 3MHz (Dual)
Model
208230
208231
Oscillator Model
20110 (QD-027)
20110 (QD-027)
Frequency, Allowable Input
950kHz/50W, 3MHz/30W
950kHz/50W, 3MHz/30W
Housing Material
ECTFE
ECTFE
Transducer Plate Material
Quartz
Sapphire
Operating Liquid Temperature
15–40°C
15–40°C
Liquid Flow Rate
1.0–2.0L/min
1.0–2.0L/min
Air Purge Flow Rate
Approx. 10L/min (below 0.02MPa)
Approx. 10L/min (below 0.02MPa)
Dimensions
65(W)×74(D)×38(H)mm
65(W)×74(D)×38(H)mm
Weight
Approx. 0.4kg
Approx. 0.4kg
FACT BOX
- Source: PR TIMES
- Category: New Product
- Products / services: QUAVA mini Mega Puck