JASP Inc. Begins Full-Scale Launch of Products from Global Top 3 ACF Manufacturer "H&S HighTech Corp." in the Japanese Market

JASP Inc. (Chiyoda-ku, Tokyo) has officially commenced sales and marketing activities in the Japanese market for products from "H&S HighTech Corp.", a South Korean manufacturer of ACF (Anisotropic Conductive Film).

H&S HighTech Corp. is an electronic materials manufacturer from South Korea that has been involved in the development and manufacturing of bonding materials for displays for over 30 years. It holds a top 3 global market share in the field of ACF (Anisotropic Conductive Film) and supplies products to major display manufacturers and electronics manufacturers worldwide.

In recent years, driven by the expansion of markets for AI servers, high-performance semiconductors, data centers, and 5G/high-speed communication equipment, demand for high-precision and high-reliability bonding materials has been increasing. In response to this market environment, the company is accelerating its expansion into the semiconductor packaging materials field, in addition to its display materials business. It is working to expand its business domain by developing products such as Build-up Films and the next-generation bonding material "PMF (Pattern Matching Film)".

What is ACF (Anisotropic Conductive Film)?

ACF is an electronic material used in the connection process for electronic components, semiconductor packages, FPCs, display panels, and other devices. It is widely adopted as a bonding material that simultaneously achieves electrical connection and mechanical bonding.

It consists of a thermosetting resin film with uniformly dispersed conductive particles, and simultaneously achieves three functions:

"Electrical conductivity" to realize electrical continuity in the connection part

"Insulation" to prevent short circuits between adjacent circuits

"Adhesion" to firmly fix components

Today, it is used in the mounting processes of a wide range of electronic devices, including LCDs, OLEDs, automotive displays, camera modules, and semiconductor packages.

Advanced Technology Supporting Next-Generation Mounting

H&S HighTech Corp. is developing its own ACF technology for next-generation electronic devices that are increasingly adopting high-density mounting and Fine Pitch designs. Representative technologies include:

"Hyper-even Distribution ACF" which uniformly arranges conductive particles to reduce variations in resistance and prevent short circuits.

"Non-flow ACF (NFA)" which supports Fine Pitch mounting.

"Solder ACF/NCF" which achieves low resistance and high current through metal bonding.

"Direct Bonding technology" for ultra-fine mounting.

These technologies enable high-density mounting and high-reliability connections.

Evolution into a Semiconductor Packaging Materials Manufacturer

According to market research firms, the market for semiconductor substrate materials is projected to grow to approximately 730 billion yen by 2031 (with an average annual growth rate of 19%), driven by increasing demand for AI, data centers, and 5G infrastructure.

In response to this market environment, H&S HighTech Corp. is actively investing in its semiconductor packaging materials business. Currently, in addition to developing Build-up Films for semiconductor substrates, it is promoting the development of new technologies in the semiconductor mounting field, such as the announcement of the next-generation bonding material "PMF (Pattern Matching Film)".

Based on the display materials technology cultivated over many years, the company is accelerating its business expansion into the semiconductor, AI, and data center related markets, and is pioneering new growth areas as an electronic materials manufacturer.

JASP to Handle Sales and Technical Proposals in the Japanese Market

JASP Inc. will be responsible for the sales and technical support of H&S HighTech Corp. products in the Japanese market, proposing ACF solutions tailored to specific applications and mounting conditions.

The company will establish a comprehensive technical support system from prototype evaluation to mass production introduction, providing high-quality bonding materials and technical support to manufacturers in a wide range of fields, including displays, electronic components, automotive equipment, and semiconductor packages.

JASP Inc. plans to continue introducing cutting-edge overseas electronic materials and advanced technologies to the Japanese market, while contributing to technological innovation and improved product competitiveness in Japan's manufacturing industry.

JASP Inc.

http://www.jasp.co.kr/

Kasumigaseki Business Center 401, 3-7-1 Kasumigaseki, Chiyoda-ku, Tokyo

Tel. 03-3508-4200

e-mail. [email protected]