U-MAP to Systematically Launch New Thermal Design Concept 'Thermal Network Design' at Four 2026 Exhibitions — Starting Tomorrow, July 15 at TECHNO-FRONTIER 2026

U-MAP Corporation (Nagoya, Aichi Prefecture; President and CEO: Kenji Nishitani) plans to exhibit at four major domestic exhibitions in fiscal year 2026, beginning with a joint exhibition alongside Okamoto Glass Co., Ltd. at 'TECHNO-FRONTIER 2026 Thermal Design & Countermeasure Technology Expo' (Tokyo Big Sight), opening on Wednesday, July 15, 2026.

Background of the Announcement — The Paradox of 'Not Cooling Despite Increased Filler'

As EVs, AI semiconductors, and power devices become increasingly high-powered, demands on thermal management materials grow ever more stringent. Conventional thermal design has aimed to improve thermal conductivity by increasing the loading of spherical fillers. However, this approach creates a structural contradiction: higher filler loading increases resin viscosity, leading to reduced moldability and degraded mechanical strength.

U-MAP directly addresses this contradiction with a unique approach centered on 'Thermalnite®'—the world’s only manufacturable fibrous aluminum nitride (AlN) single-crystal filler. By enabling fibers to function as a 'Thermal Network' (TN), U-MAP is making a paradigm shift—from 'designing by increasing filler loading' to 'designing heat escape paths'—to fundamentally resolve this challenge.

In fiscal year 2026, U-MAP will exhibit throughout the year at major exhibitions in the fields of thermal design, materials, and chemical materials, expanding engagement with engineers and material developers.

2026 Exhibition Schedule Overview

Upcoming Event Details: TECHNO-FRONTIER 2026 Thermal Design & Countermeasure Technology Expo

At this booth (3-F21), visitors can examine the following products and technologies with real samples and data:

· Hybrid Filler (Thermalnite® fiber + spherical AlN)

Fibers bridge spherical particles, forming continuous thermal conduction paths even at low filler loading. Exhibiting a range of products including large-particle type (up to 15 W/m·K), small-particle type (4.6 W/m·K), and ultrafine-particle type (under development), tailored to various applications.

· TIM Sheets

High thermal conductivity thermal interface sheets (12.5 W/m·K) and low thermal resistance sheets (prototype). Implementation examples for power modules and optical communication devices will also be presented.

· High-Strength AlN Substrate (Joint Exhibition with Okamoto Glass Co., Ltd.)

Thermal conductivity of 170–230 W/m·K; fracture toughness doubled compared to conventional substrates due to Thermalnite® fiber addition. Mass production certification already obtained.

Exhibitor Seminar (TECHNO-FRONTIER 2026)

Date and Time: Thursday, July 16, 2026, 11:00–11:50

Venue: West Hall, Exhibitor Seminar (3)

Speaker: Kenji Nishitani (President and CEO, U-MAP Corporation)

Topic: Pioneering Next-Generation Thermal Material Design with the World’s Only Fibrous AlN Single-Crystal Filler 'Thermalnite® (Thermalnite)'

— An Optimization Approach to Thermal Conductivity, Mountability, and Reliability via Hybrid Fillers —

Capacity: First-come, first-served (prior registration recommended)

Prior Registration: https://www.jma-exhibition.com/joint/jp_tf/registration_seminar.php

This 50-minute seminar will explain the conceptual shift from 'designing by increasing filler loading' to 'designing heat escape paths' and the technical foundation of hybrid fillers that enable it. Seating is limited.

※ An updated version of this seminar will also be presented at the 1st High-Functionality Materials Expo (October 1, 2026, Makuhari Messe), offering another opportunity for those unable to attend this session.

Event Overview (TECHNO-FRONTIER 2026)

Exhibition Name: TECHNO-FRONTIER 2026 | Thermal Design & Countermeasure Technology Expo

Dates: Wednesday, July 15 – Friday, July 17, 2026, 9:30–17:00

Venue: West Hall, Tokyo Big Sight

Booth Number: 3-F21

Co-Exhibitor: Okamoto Glass Co., Ltd.

Admission: Free (prior registration required)

Details: https://umap-corp.com/news/techno-frontier-2026

About U-MAP Corporation

U-MAP is a materials startup originating from Nagoya University. It is the only company in the world with the proprietary technology and mass production capability to manufacture fibrous AlN single-crystal filler 'Thermalnite®'. Through its unique thermal design approach—using fibers as a thermal network—U-MAP addresses thermal challenges in EVs, power devices, and AI semiconductors. To date, it has conducted business discussions with over 300 companies and sample evaluations with more than 150. Certified under ISO 9001 and ISO 14001. Over 20 patent applications filed. Thermalnite® is already in mass production.

Founded: December 12, 2016

President and CEO: Kenji Nishitani

Headquarters: TOIC 601, Furou-cho, Chikusa-ku, Nagoya, Aichi Prefecture

Corporate Website: https://umap-corp.com/

Contact: https://umap-corp.com/contact

Inquiries Regarding This Announcement

Business Development Department, Public Relations & Marketing Group

Contact: Yamada

E-mail: [email protected]

Contact form: https://umap-corp.com/contact