Announcement: Zoom Seminar on 'Epoxy Resin Material Design, Curing Reactions, and Evaluation Technology' on July 27 (Mon)

AndTech Co., Ltd. (Headquarters: Kawasaki, Kanagawa; President: Masao Suyama) will hold a seminar explaining the 'application of epoxy resins to basic electronic materials' as part of its R&D support services. The seminar will cover applications for various uses, such as semiconductor encapsulants and adhesives. The performance of epoxy resins changes significantly depending on the design of curing reactions, curing agents, and additives. In this course, we will organize the types, synthesis, and curing mechanisms of epoxy resins, as well as evaluation methods and types of additives, to explain their application development. The seminar will be held on Monday, July 27, 2026, from 13:00 to 17:00, via Zoom live streaming. The participation fee is 45,100 yen (tax included). The lecturer is Professor Hirofumi Nishida of the Department of High-Reliability Manufacturing at Kanazawa Institute of Technology. The program will cover resin types, synthesis methods, reaction mechanisms of curing agents, evaluation methods, the role of additives, and formulation examples for semiconductor encapsulants and adhesives.