AndTech to Host Webinar on 'Hybrid Bonding Technology for Next-Gen Semiconductor Packaging: Bonding, Resin Materials, and Dicing Technology' on August 24 (Mon), 2026

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; President & CEO: Masao Suwayama; hereinafter "AndTech") will launch a specialized lecture series titled "Hybrid Bonding" as part of its Zoom-based R&D support programs, featuring leading industry experts.

This seminar will cover the fundamentals, latest trends, and key technologies related to hybrid bonding, including bonding methods, materials, and dicing processes.

The seminar is scheduled to be held on August 24, 2026.

Details: https://andtech.co.jp/seminars/1f178f09-8363-695a-8e02-064fb9a95405

Live Webinar Seminar Overview

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Theme: Hybrid Bonding Technology for Next-Generation Semiconductor Packaging and Bonding, Resin Materials, and Dicing Technology

～Technical Challenges in Chip-to-Wafer Bonding, Polyimide Materials, and Machining Technologies for High Surface Cleanliness～

Date & Time: August 24, 2026 (Mon) 13:30–17:45

Registration Fee: 60,500 JPY (tax included) ※ Electronic materials will be distributed

URL: https://andtech.co.jp/seminars/1f178f09-8363-695a-8e02-064fb9a95405

Web Delivery Format: Zoom (URL will be sent after registration)

Seminar Program and Speakers

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—Program & Speakers—

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Part 1: Challenges and Recent Trends in Hybrid Bonding Technology

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Speaker: Prof. Takashi Fukushima, Graduate School of Biomedical Engineering, Tohoku University

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Part 2: Hybrid Bonding Technology Using Polyimide Insulating Materials

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Speaker: Masao Tokawa, Toray Industries, Inc.

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Part 3: D2W Hybrid Bonding and Dicing Technology

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Speaker: Shunsuke Teranishi, Technical Development Division, DISCO Corporation

Knowledge and Technical Issues to Be Addressed in This Seminar

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・Fundamentals, applications, recent advancements, and challenges in hybrid bonding

・Requirements for dicing processes in hybrid bonding

・Latest trends and characteristics of blade dicing, laser dicing, and other technologies

・Technical challenges and future directions in dicing for hybrid bonding applications

Seminar Format

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This is a live webinar seminar conducted via the web conferencing tool "Zoom."

Further details will be provided after registration.

About AndTech Co., Ltd.

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AndTech provides R&D support services by delivering information to clients engaged in research and development across a wide range of fields, including chemicals, materials, electronics, automotive, energy, medical devices, food packaging, and construction materials.

We assemble a team of top-tier instructors and offer various services, starting with technical seminars and workshops, followed by speaker dispatch, publishing, consultant dispatch, market trend research, business matching, and business development consulting.

We listen closely to our clients’ needs and provide effective support to help them enter desired new business areas and markets.

https://andtech.co.jp/

AndTech Technical Seminars

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We host numerous web-based seminars featuring top experts every month.

https://andtech.co.jp/seminars/search

AndTech Publications

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We publish books on carefully selected, high-demand topics.

https://andtech.co.jp/books

AndTech Consulting Services

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We dispatch highly specialized technical consultants with extensive experience.

https://andtech.co.jp/business-consulting

Inquiries Regarding This Announcement

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Public Relations Contact: Aoki AndTech Co., Ltd. Email: pr●andtech.co.jp (Please replace ● with @)

Full Seminar Program (Recommended for Those Interested in Details)

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Part 1: Challenges and Recent Trends in Hybrid Bonding Technology

【Presentation Overview】

This session will explain "Cu-Cu hybrid bonding," an essential technology for building chiplet semiconductor systems that are key to realizing next-generation AI societies.

It will cover the fundamentals, applications, recent advancements, and challenges of Chip-to-Wafer hybrid bonding. In addition to introducing our research presented at ECTC—the premier international conference on semiconductor packaging technology—we will review notable hybrid bonding-related papers published over the past five years and highlight key insights from ECTC 2026.

【Program】

1. History and Necessity of Hybrid Bonding

2. Applications of Hybrid Bonding

3. Fundamentals and Challenges of Hybrid Bonding

4. Recent Advancements in Hybrid Bonding

5. Highlights from ECTC 2026

6. Summary

【Q&A】

【Key Points of the Presentation】

Using recent papers presented at ECTC over the past five years as examples, this session will clarify the technical challenges in hybrid bonding—particularly Chip-to-Wafer hybrid bonding—and explain the latest trends, including application-specific requirements.

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Part 2: Hybrid Bonding Technology Using Polyimide Insulating Materials

【Presentation Overview】

This session will trace the evolution of semiconductors and hybrid bonding technology, provide an overview of various hybrid bonding techniques, and highlight the characteristics and challenges of resin-based hybrid bonding technology.

【Program】

1. Introduction to Toray

2. Semiconductor Evolution and Hybrid Bonding Technology

3. Types of Hybrid Bonding Technologies

4. Resin-Based Hybrid Bonding Technology

5. Summary

【Q&A】

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Part 3: D2W Hybrid Bonding and Dicing Technology

【Presentation Overview】

D2W hybrid bonding has already entered mass production for certain advanced logic devices and is expected to expand to various other devices in the future.

Meanwhile, dicing processes in hybrid bonding