Bemap, Inc. announced it will jointly exhibit with Accton Technology Corporation at 'Wireless Japan x Wireless Technology Park 2026', held at Tokyo Big Sight from May 27th (Wed) to 29th (Fri), 2026, hosted by Ric Telecom Co., Ltd.

The company will set up a booth within the joint exhibition space of the 802.11ah Promotion Council (AHPC) and the Wireless LAN Business Promotion Association (Wi-Biz). The exhibit will focus on Edgecore Networks products, including the 'EAP112,' a Wi-Fi HaLow/6/LTE-equipped access point that functions as an IoT gateway, and the new 'EAP105' and 'EAP115' Wi-Fi 7-equipped access points.

Additionally, the company will demonstrate Wi-Fi sensing products, including HUAWEI access points, within the Wi-Biz booth. Visitors can experience the latest technology trends, such as long-range Wi-Fi HaLow and next-generation Wi-Fi 7.

FACT BOX

  • Source: PR TIMES
  • Category: Event
  • Organizations: Accton Technology Corporation
  • Products / services: EAP112 / EAP105