Live/ZOOM Seminar: Changes in Junction Structure due to Semiconductor Evolution and Packaging Response - Resin Encapsulation Technology's Response to Increased Junction Counts and Narrower Pitches

📢 Announcement of an exciting live seminar from our organizer, CMC Research, Inc. (https://cmcre.com/)

This is an announcement of an exciting live seminar.

🎓 Speaker: Shigeru Koshibe (President, I-PACK Co., Ltd.)

📆 Date and Time: Wednesday, August 5, 2026, 13:00 - 16:30

🖥️ Zoom Distribution (with materials)

💬 Theme: "Changes in Junction Structure due to Semiconductor Evolution and Packaging Response

~ Resin Encapsulation Technology's Response to Increased Junction Counts and Narrower Pitches ~"

This seminar will provide a systematic understanding of packaging technologies supporting semiconductor implementation in the AI and high-speed communication era, covering junction structures, resin encapsulation, and reliability evaluation. Participants will gain insight into the technical challenges and countermeasures required for advanced semiconductors.

📌 Participation Fee

General: ¥44,000 (tax included)

Newsletter Member: ¥39,600 (tax included)

Academic: ¥26,400 (tax included)

🔗 For details and registration, click here

🧠 A Q&A session will also be included.

We encourage those who wish to acquire practical knowledge for research, development, and manufacturing sites to attend.

【Knowledge Gained from the Seminar】

Development history and latest trends in semiconductor package (PKG) development

Changes in semiconductor junction structures and the corresponding packaging technologies

Development history, challenges, and countermeasures for resin encapsulation technologies that support the evolution of semiconductor PKGs

【Target Audience】

Individuals involved in semiconductor-related fields (sales, technical roles, etc.)

Those interested in semiconductor manufacturing technologies (front-end, back-end, etc.)

Those interested in the evolution of semiconductor PKGs and the corresponding packaging technologies

Those interested in semiconductor integration and junction technologies (Bumping Technology)

1) Seminar Theme and Schedule

Theme: Changes in Junction Structure due to Semiconductor Evolution and Packaging Response - Resin Encapsulation Technology's Response to Increased Junction Counts and Narrower Pitches

Date and Time: Wednesday, August 5, 2026, 13:00 - 16:30

Participation Fee: ¥44,000 (tax included) *Includes materials

Newsletter subscribers: ¥39,600 (tax included)

Academic price: ¥26,400 (tax included)

Speaker: Shigeru Koshibe, President, I-PACK Co., Ltd.

Seminar Objectives

Semiconductors continue to pursue higher integration, higher density, larger areas, and 3D structures. As a result, the structure of junction parts (bumps) is becoming more complex, with an increase in the number of junctions and a narrowing of the gaps. To cope with this evolution of semiconductors, packaging technologies have also developed significantly.

This seminar will provide a detailed explanation of the evolution of semiconductor packages (PKGs) and the corresponding packaging technologies, with a particular focus on the junction parts. It will introduce resin encapsulation technologies for narrow-pitch, numerous small bump structures, the technical challenges and countermeasures for their realization, and the future direction of packaging technologies required for advanced semiconductor development in an easy-to-understand manner.

This seminar is a live online seminar using the video conferencing tool "Zoom." Please refer to Zoom's guidelines for recommended environments. The viewing URL will be sent separately by email at a later date.

Recording or photography during the seminar is strictly prohibited.

2) How to Register

Please register through the CMC Research seminar website for this event.

We will send you the viewing URL by email separately upon confirmation.

Please see the URL below for details.

🔗 Click here to register

3) Seminar Program Introduction

(Includes an intermission)

1. Evolution of Semiconductor PKGs and Junction Parts

1.1 Semiconductor PKGs

1) Development history; High integration, high density

2) PKG types; WLP, PLP, Composite PKG

1.2 Semiconductor PKGs and Junction Parts

1) PKG and circuit board; Junction methods (lead frame to sub-board)

Mounting methods (pin insertion to surface mounting)

2) Chip and connection circuits; Connection methods (gold wire to micro solder ball)

Connection countermeasures (FI to FO, CoC/TMV, etc.)

1.3 Improving and verifying the reliability of junction parts

1) PKG and circuit board; Reinforcement, thermal strain evaluation (analysis, observation, etc.)

2) Chip and connection circuits; Filling, gap evaluation (soft X-ray, UST, etc.)

2. Semiconductor Packaging Technology Response

2.1 Encapsulation Technology

1) Development history

2) Encapsulation methods; Hermetic sealing / Resin encapsulation (transfer molding, etc.)

2.2 Encapsulation Materials

1) Overview; Types, development history, applications, manufacturers

2) Material specifications; Composition, raw materials

3) Manufacturing specifications; Manufacturing methods, quality control methods

2.3 Evaluation of Encapsulation Materials

1) Material properties; Flowability, curability, moldability, dispersibility

2) Cured material properties; General properties, adhesion, reliability (accelerated testing, analysis)

2.4 Challenges and Countermeasures in Encapsulation Technology

1) Resin encapsulation; Large area, narrow gap injection, variations

2) Substrate mounting; Composite PKG mounting, defect analysis

【Q&A Session】

4) Speaker Introduction

Shigeru Koshibe, President, I-PACK Co., Ltd.

【Speaker's Background】

Graduated from Osaka University, Faculty of Engineering, 1974

Completed Master's Program, Graduate School of Engineering, Osaka University, 1976

Joined Sumitomo Bakelite Co., Ltd. in 1976, engaged in the development of semiconductor encapsulating materials, etc.

Joined Tonen Chemical Corporation in 1988, engaged in the development of silica, silicone gels, etc.

Established I-PACK Co., Ltd. in 2001, responsible for technical consulting in the development of elemental materials in the semiconductor and optical fields.

【Activities】

Over 200 patent applications, over 60 books authored, over 200 seminars conducted.

【Activities and Publications】

Books on Semiconductor Encapsulation

1) Nikkei Microdevices, May 11, 1984, pp. 82-92

・Low-stress epoxy encapsulants for VLSI

2) Nikkei Microdevices, November 2002, pp. 70-71

・Preventing recurrence: Urgent need to investigate causes and review evaluation methods (Fujitsu HDD issue)

3) Electronic Materials, August 2004, pp. 44-46 & Electronic Technology, January 2005, pp. 90-93

・Trends in Semiconductor Packaging

4) Encyclopedia of Encapsulation Technology and Material Development for Latest Semiconductors and LEDs, pp. 296-304 (Technical Information Association, November 2006)

・Failure mechanisms and countermeasures for resin materials used in semiconductor encapsulation

5) Formulation Design and High Functionality of Epoxy Resins, pp. 166-174, 190-107 (Science & Technology, August 2008)

・High functionality of epoxy resins used in rigid printed circuit boards

・High functionality of epoxy resins in semiconductor encapsulating materials

6) Design and Application of Antistatic Materials, pp. 227-233 (Science & Technology, December 2008)

・Antistatic technology in encapsulating materials

7) Electronic Materials, July 2009, pp. 86-90

・Latest trends in thin-film materials for next-generation packaging

8) Latest Technology of Heat-Resistant Polymer Materials for High-Performance Devices, pp. 65-73 (CMC Publishing, April 2011)

・Technical trends in high heat resistance and high heat dissipation materials for power devices in automotive, low-voltage, and electronic components

Books on Semiconductor Encapsulation (2)

9) Material Stage, November 2011, pp. 32-34

・Current status surrounding encapsulation technology and materials

10) New Technologies for Miniaturization in New Product Development, pp. 404-408 (Technical Information Association, October 2012)

・Performance requirements for semiconductor encapsulating materials for miniaturization

11) Material Design and Process Technology for Encapsulation and Sealing in Advanced Electronics, pp. 473-478 (Technical Information Association, August 2013) Challenges

・Recent requirements and evaluation methods for semiconductor encapsulating materials

12) Mechanism of Bubble/Void Generation and Measures for Prevention and Removal, pp. 388-393 (Technical Information Association, February 2014)

・Causes of bubble generation in encapsulating materials and countermeasures

13) Functional Materials, January 2015, pp. 3-4, 11-18

・Thermal management technology in polymer materials for next-generation power devices

・Latest technological trends in encapsulating materials for power devices

14) Property Improvement and High-Function Composite Technology of Epoxy Resins for Electronics, pp. 249-253 (Technical Information Association, February 2015)

・Effective use and selection of curing agents in the field of epoxy resin encapsulation

15) Elucidation of Residual Stress Generation Factors in Polymer Materials and Reduction Measures, pp. 177-184 (Technical Information Association, February 2017)

・Mechanism of internal stress generation in encapsulating materials and countermeasures

16) Development Trends in Next-Generation Semiconductor Packaging and Required Packaging/Material Technologies (Science & Technology, July 2017)

Books on Semiconductor Encapsulation (3)

17) Thermal Management Technologies Required for Future EV/HEV, pp. 81-94 (Information Society, August 2018)

・Heat dissipation measures for encapsulating materials for power devices and development of next-generation packaging technologies

18) High Functionality of Epoxy Resins and Their Effective Use, pp. 81-88 (R&D Support Center, November 2018)

・Selection and usage of epoxy resin curing agents

19) Development of High Thermal Conductivity Resins, pp. 356-366 (Technical Information Association, July 2019)

・Properties and high heat dissipation of encapsulating materials for power devices

20) Guidelines for Material, Component, and Device Design and Development for 5G Compatibility, pp. 15-36 (Information Society, September 2019)

・Overview of high-speed wireless communication for the 5G era and considerations for semiconductor speed enhancement

21) General Treatise on Semiconductor Encapsulating Materials (Science & Technology, November 2019)

22) R&D Leader, May 2020, pp. 14-26

・Materials and technologies for semiconductor packaging changing with 5G

23) High-Speed Systems and Their Constituent Components for 5G and Beyond 5G (CMC Research, June 2020)

24) Collection of Technical Information and Materials on Encapsulation/Barrier/Protection/Sealing, pp. 3-11, 329-335 (Technical Information Association, April 2021)

・Overview of encapsulation, barrier, and sealing technologies

・Overview of recent requirements and evaluation methods for semiconductor encapsulating materials

Books on Semiconductor Encapsulation (4)

25) Selection and Usage of Polymerization Initiators, Curing Agents, and Crosslinking Agents, and Case Studies, pp. 592-600 (Technical Information Association, May 2021)

・Design and curing systems used for printed circuit boards and encapsulating materials for electronics

26) Development Trends and Application Expansion of Next-Generation Power Semiconductors, pp. 269-282 (CMC Publishing, August 2021)

・Packaging technologies and challenges for power devices for high-speed communication equipment

27) Development Trends in Semiconductor Packaging and Material Technologies Entering a Period of Reform (Science & Technology, January 2022)

28) Encapsulation and Barrier Technologies for Advanced Devices, pp. 97-110, 111-125 (CMC Publishing, December 2022)

・Latest trends in semiconductor packaging technology and trends in power device encapsulation technology

29) Automotive Technology, April 2023, pp. 1-8 (Vol. 10, No. 7, 2023)

・Latest trends in advanced semiconductor packaging and future encapsulation technology requirements

30) Formulation Design and High Functionality of Epoxy Resins, pp. 255-264 (Technical Information Association, October 2023)

・Characteristics of epoxy resin materials for semiconductor encapsulation and trends in advanced semiconductor packaging

31) Implementation Materials, Technologies, and Thermal Management for Next-Generation Power Devices, pp. 241-253 (Technical Information Association, August 2024)

・Required properties and challenges of encapsulating materials for power devices for new substrates such as SiC

32) R&D Leader, August 2025, pp. -

・Domestic and international trends in advanced semiconductor packaging technology and the movements of key players

Books on Silicon Chemicals

1) Chemistry and Industry 1995, 48(6) pp. 696-698

・"αGEL", an Untried Material for the 21st Century

2) Electronic Materials, September 1995, pp. 127-130

・New developments in the multifunctional material αGEL

3) Industrial Materials, October 1995, pp. 45-47

4) Gel Handbook, pp. 180-187 (NTS, November 1997)

・Viscoelasticity and evaluation methods of vibration-damping gels

5) Electronic Materials, July 2002, pp. 72-74

・Functional silica for CSP adhesive materials

6) Electronic Materials, May 2003 Special Issue, pp. 90-90

・Ultra-high purity fumed silica for wafer-level packaging

7) Encyclopedia of Encapsulation Technologies and Material Development for Latest Semiconductors and LEDs, pp. 198-206 (Technical Information Association, November 2006)

・Overview and usage examples of fillers

8) Design and Manufacturing Technology of Transparent Resins in Various Optical Materials, pp. 484-488 (Information Society, December 2007)

・Connection components and connection materials (optics)

Reference) Books on Silicon Chemicals (2)

9) High Functionality and Application of Films and Resins Used in Solar Cells, pp. 264-269 (Technical Information Association, March 2010)

・Properties of silicone resins and their application to solar cell components

10) Countermeasures for Degradation and Discoloration of Transparent Resins and Their Evaluation, pp. 20-24, 126-129 (Technical Information Association, March 2012)

・Heat resistance of silicone resins and improvement of heat resistance by silica modification/silicone modification

・Weather resistance of silicone resins and improvement of weather resistance by silica modification/silicone modification

11) Imparting Functionality to Films and Coating Agents Without Compromising Transparency, pp. 60-63 (Technical Information Association, November 2012)

・Characteristics of silica and high heat resistance and high transparency by silica hybrid

12) Imparting Multifunctionality to Transparent Resins and Films and Application Technologies, pp. 96-101 (Technical Information Association, November 2014)

・High heat resistance and high transparency of transparent resins by nano-silica hybrid

Books on Optical Materials

1) Electronic Materials, July 2003, pp. 18-21

・Verification and essential technologies for commercialization of plastic optical fibers

2) Electronic Materials, February 2004, pp. 82-85 & Electronic Technology, July 2004, pp. 96-99

・Current status of plastic optical fiber applications

3) Electronic Materials, September 2005, pp. 81-85 & Electronic Technology, April 2006, pp. 102-106

・Overview of transparent materials for LED/OLED

4) Analysis, Control, and Troubleshooting of Thermal Stress in Electronic Materials and Packaging Technology, pp. 345-353 (Technical Information Association, January 2006)

・LED encapsulating resin materials

5) Electronic Materials, September 2006, pp. 31-34 & Electronic Technology, May 2007, pp. 84-87

・LED packaging technology

6) Electronic Materials, May 2007 Special Issue, pp. 65-68

・Organic EL encapsulation materials

7) Design and Manufacturing Technology of Transparent Resins in Various Optical Materials, pp. 121-125, 126-129, 154-158, 189-195 (Information Society, December 2007)

・Thermosetting epoxy resins and UV-curable epoxy resins

・Current status and issues of epoxy-based encapsulating resins and resin encapsulants for LEDs

8) Electronic Materials, April 2009, pp. 71-73 & Electronic Technology, March 2010, pp. 95-98

・Composite materials for high-heat-generating LEDs

Reference) Books related to optical materials (2)

9) High-Performance Device Encapsulation Materials and Cutting-Edge Materials, pp. 114-125 (CMC Publishing, 2009.8)

・LED Encapsulation

10) Monthly Display, February 2010, pp. 65-70

・Current status and future of LED encapsulation materials

11) High-functionality and application of films and resins used in solar cells, pp. 164-169 (Technical Information Association, 2010.3)

・Prevention of degradation of polymer materials due to oxidative degradation and related technologies

12) High-efficiency processes and material technologies for LED lighting, pp. 303-312 (Science & Technology, 2010.5)

・Composite materials for high-heat-generating LEDs

13) Functionalization of films and coatings without compromising transparency, pp. 793-796, 971-976, 979-983 (Technical Information Association, 2012.11)

・High dispersion technology in the manufacturing of nanofiller compounds

・Encapsulation technology for photodetectors (solar cells, photodiodes) and required materials

・Encapsulation technology for light-emitting elements (LEDs) and required materials

14) "Control Technology of Light" and its Application Examples, pp. 513-517 (Technical Information Association, 2014.3)

・Wavelength conversion materials and their manufacturing methods

15) Functional Materials, August 2014, pp. 23-30

・Use of encapsulants and films for improving light extraction efficiency in OLED lighting

16) Epoxy Resins for Electronic Materials - Cutting-Edge Technology in Semiconductor Packaging Materials, pp. 193-205 (CMC Publishing, 2015.3)

・Encapsulation materials and films for LEDs

Reference) Books related to optical materials (3)

17) Latest OLED Display Development Approached from Constituent Elements, pp. 13-23 (CMC Publishing, 2017.2)

・Development of encapsulation members for OLED display devices

18) Micro-LED Manufacturing Technology and Challenges for Mass Production/Development Trends (Science & Technology, 2018.6)

19) Development Trends in Materials and Process Technologies for Next-Generation Display Applications, pp. 437-462 (Technical Information Association, 2020.2)

・Micro-LED display manufacturing technology, development status, and challenges for mass production

20) Photosemiconductors and their Packaging Encapsulation Technology (Science & Technology, 2023.2)

View Details

5) Announcement of Upcoming Webinars (Online Distribution Seminars)

〇Basic Course on Semiconductor Packaging Technology

~ From the evolution of packaging forms to manufacturing processes, equipment and materials used, and the latest trends ~

Thursday, July 2, 2026, 13:30 - 16:30

https://cmcre.com/archives/143857/

〇Industrial applications of powder materials and metal powders in metal 3D printing

Tuesday, July 7, 2026, 13:30 - 16:30

https://cmcre.com/archives/143625/

〇Basics and applications of non-fluorinated water and oil repellent coatings, and development trends

Wednesday, July 8, 2026, 13:30 - 16:30

https://cmcre.com/archives/141003/

〇Measurement and research applications of microbial dynamics using microbial activity analyzers

Wednesday, July 15, 2026, 13:30 - 16:30

https://cmcre.com/archives/144702/

〇Explanation of remaining capacity and degradation estimation technology for optimal management of lithium-ion batteries

... Focusing on operating principles, modeling, and control methods, with perspectives on battery type and application for EVs, HEVs, and PHEVs

Wednesday, July 22, 2026, 10:30 - 16:30

https://cmcre.com/archives/144769/

〇Basics and procedures of sensory evaluation of food, and key points of methods

Wednesday, July 29, 2026, 10:30 - 16:30

https://cmcre.com/archives/145315/

〇Changes in junction structure due to semiconductor evolution and packaging response

~ Resin encapsulation technology's response to increased junction counts and narrower pitches ~

Wednesday, August 5, 2026, 13:00 - 16:30

https://cmcre.com/archives/144619/

〇Computational science simulation technology at the core of materials informatics

Friday, August 7, 2026, 10:30 - 16:30

https://cmcre.com/archives/144592/

〇Thorough explanation of the basics of food inspection, directly applicable to practice

Thursday, August 20, 2026, 13:30 - 15:30

https://cmcre.com/archives/145033/

〇Resource recovery of low-temperature heat by thermoelectric generation and new energy utilization

Tuesday, August 25, 2026, 13:30 - 16:30

https://cmcre.com/archives/145378/

〇How to tackle the confusing plastic and fiber problem?

~ The future of circular economy technologies that transform the lifecycle of materials ~

Friday, August 28, 2026, 13:30 - 16:30

https://cmcre.com/archives/146121/

〇Battery technician training course utilizing battery factories:

2nd session: Manufacturing technology of lithium-ion batteries - Applied edition (Ternary cathode and graphite/silicon anode)

★This course is a 5-day hands-on training course including accommodation!

Monday, August 31, 2026 - Friday, September 4, 2026

https://cmcre.com/archives/145259/

☆Click here for a list of scheduled webinars

CMC Research Inc. (Kanda-Nishikicho, Chiyoda-ku: https://cmcre.com/), which provides advanced technology and market information, offers seminars and publishes books on market and technology trends for various materials and chemicals.

6) Announcement of Related Books

☆Click here for a list of published books

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