COMPUTEX Taipei: Foxconn Showcases AI Infrastructure, Robotics, and Space Data Centers

Central News Agency, Taipei, June 1st. COMPUTEX 2026 opens on the 2nd. Foxconn announced today that it will showcase its latest AI infrastructure, smart manufacturing, smart EV, and smart city platforms, along with robotics, medical, and space data center applications. Foxconn also announced a partnership with French AI high-performance computing leader Bull to jointly develop the European AI Data Center (AIDC) industry. Bull will lead system design while Foxconn handles manufacturing, leveraging both companies' strengths to accelerate European AI infrastructure development. Regarding AI infrastructure, Foxconn will demonstrate its manufacturing and system integration capabilities for NVIDIA's Vera Rubin NVL72, as well as the latest AI servers and high-speed interconnect technologies, including the NVIDIA Groq 3 LPX, Vera processor platform, HGX Rubin NVL8 platform, and MGX 2U/4U modular systems. In the fields of agentic AI, edge computing, and next-generation communications, Foxconn is collaborating with Intel to showcase AI servers, high-speed optical communication solutions, and next-generation 5G DU Edge Servers. Foxconn also highlighted its collaboration with AMD. In the space data center sector, Foxconn is partnering with Ramon.Space to showcase applications and next-generation communication technologies, extending AI infrastructure beyond Earth. The booth will also feature key optical transmission technologies such as Co-Packaged Optics (CPO) and 1.6T optical modules, as well as critical components like PCBs and liquid cooling plates, demonstrating the group's vertical integration in AI servers. For AI computing applications, Foxconn introduced its AI Agent Cloud GPU platform and the CoDoClaw clinical intelligent agent system based on NVIDIA NemoClaw. On the manufacturing side, Foxconn is exhibiting wheeled humanoid robot solutions, combining NVIDIA Isaac Teleop and Physical AI technologies to demonstrate high-precision industrial assembly applications.