Foxconn Breaks Ground on Advanced Packaging Plant in France to Boost European Tech Sovereignty

Foxconn Technology Group, alongside French firms Thales and Radiall, has established a joint venture named Tessalia to invest in semiconductor advanced packaging and testing (OSAT) technology. The groundbreaking ceremony took place on the 1st in Le Barp, southwestern France. Foxconn aims to strengthen its European footprint, while the French side emphasizes technological sovereignty. Tessalia is located in Le Barp, about 40 minutes south of Bordeaux, with production expected to begin by the end of 2029. The goal is to produce over 50 million System-in-Package (SiP) components annually by 2033, making it one of the most prominent industrial investment projects in Europe. As part of President Emmanuel Macron's 'Choose France' initiative, the investment exceeds €250 million (approximately NT$9.16 billion). Attendees at the ceremony included Foxconn's S-Group General Manager Chen Wei-ming and French Minister for Industry Sébastien Martin. Chen stated that the factory serves as a strategic platform to enhance the resilience of the European semiconductor supply chain. French officials highlighted that the project is significant for establishing domestic production capabilities in strategic sectors, reducing reliance on other nations.