Foxconn's Advanced Packaging Plant to be Located in Le Barp, France

Central News Agency, Le Barp, France, June 1. Tessalia, a joint venture between Foxconn Technology Group and French companies, will be located in Le Barp in southwestern France. Chen Wei-ming, General Manager of Foxconn's S-Group, said that the location is near the "Route des Lasers" industrial cluster, has stable water and electricity supplies, and offers high quality of life, making it an ideal environment for semiconductor development. Le Barp, located about 30 kilometers south of Bordeaux, has a population of nearly 6,000. Foxconn announced last May that it would establish a joint venture with French firms Thales and Radiall to invest in semiconductor advanced packaging and testing (OSAT). Hao Pei-chih, Taiwan's representative to France, revealed that there were 72 site proposals across France. The Nouvelle-Aquitaine region is a major industrial hub in France, covering aerospace, pharmaceuticals, energy, IT, and AI. Alain Rousset, President of the Nouvelle-Aquitaine region, has been very supportive of Taiwan, actively lobbying to bring Tessalia to Le Barp. Le Barp is home to the Aquitaine Technology Research Center (Cesta) under the French Alternative Energies and Atomic Energy Commission (CEA), which is highly significant. Tessalia is expected to start production by the end of 2029, aiming to produce over 50 million System-in-Package (SiP) components annually by 2033, creating about 800 jobs once fully operational.