Winbond's June and Q2 Revenue Hit New Highs, Aided by AI Test Interfaces

(CNA) - Semiconductor test interface manufacturer Winbond announced its unaudited consolidated revenue for June today, reaching NT$1.46 billion, an increase of 36% month-on-month and 287.9% year-on-year, setting a new single-month record. The company's unaudited revenue for the second quarter was NT$3.523 billion, a 18.2% increase quarter-on-quarter, also a new quarterly high. Winbond's cumulative unaudited revenue for the first half of the year was NT$6.503 billion, a year-on-year growth of 70.27%, marking a new high for the same period.

Winbond explained that the significant revenue growth in June was driven by the sustained strong demand from global Artificial Intelligence (AI) and High-Performance Computing (HPC) customers, with continued shipments of high-end Coaxial Sockets and MEMS probe cards.

Looking ahead to the full year, Winbond had previously anticipated that its revenue would likely set new quarterly highs throughout the year as new production capacity continues to come online.

Winbond is continuously expanding its probe and processed parts production capacity. The company previously stated that its Nanzi plant in Kaohsiung increased its monthly production capacity to 6 million probes in the first half of this year and expects to further increase monthly capacity to 9 million probes by the end of this year. A new plant in the Renwu Industrial Park in Kaohsiung is scheduled to begin production in the second quarter of 2027, with probe monthly capacity expected to significantly increase to 14 million probes next year. (Editor: Huang Kuo-lun) 1150706

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