Apple and Broadcom Reach $30 Billion Deal to Boost U.S. Manufacturing

SAN FRANCISCO (CNA) - Apple Inc. announced today it has reached a multi-year agreement with chipmaker Broadcom Inc. worth more than $30 billion (approximately NT$963 billion) to design and manufacture chips in the United States.

Under the agreement, Broadcom will invest $1.5 billion to expand its own manufacturing facilities in Fort Collins, Colorado. Apple stated that this agreement will lead to the production of at least 15 billion chips and supports its cooperation with the Trump administration to increase domestic component procurement.

Under outgoing CEO Tim Cook, Apple has faced continuous pressure from U.S. President Trump due to its heavy reliance on overseas production, particularly manufacturing in China.

Cook thanked Trump and his administration for supporting this initiative. He said, "The cutting-edge components produced in Fort Collins are essential for delivering the exceptional performance and connectivity our customers expect."

Hock Tan, CEO of Broadcom, stated that this increased commitment provides the company with an opportunity to expand its production footprint in Colorado. "We develop breakthrough technologies here that connect people around the world." (Compiled by Chen Cheng-chien) 1150709)

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