Foxconn Makes Debut at Japan-Taiwan Expo, Showcasing Electric Vehicles and AI Data Centers

The 2026 Japan-Taiwan Expo will take place from May 15 to 17 in Shinjuku, Tokyo. Foxconn announced on the 14th via press release its debut participation in the event. The company will showcase its capabilities in smart mobility and artificial intelligence (AI) infrastructure, unveiling its smart EV platforms, including Model A and Model B, as well as its AI Modular Data Center, all for the first time in Japan.

Wu Chun-yi, Vice President and Spokesperson of Foxconn, stated, "Japan is a key market where Foxconn continues to deepen its presence. In addition to serving Tier 1 information and communications technology customers, we have been expanding our operations in the electric vehicle and AI sectors in recent years."

Wu added, "Through this exhibition, we aim to demonstrate Foxconn’s integrated capabilities—from product design and R&D to mass production—by showcasing our smart EVs. We will also present our CDMS (Contract Design Manufacturing Services) business model and Build-Operate-Localize (BOL) strategy. Furthermore, we will debut our AI Modular Data Center (MDC), highlighting our core competencies in AI infrastructure solutions."

Foxconn explained that the Model A smart EV platform is designed with the Japanese market in mind and can be adapted into various vehicle types—such as multi-purpose vehicles (MPVs), taxis, and logistics vehicles—based on urban and industrial needs. The taxi version on display will focus on urban passenger transport services.

Meanwhile, the Model B platform targets younger generations and urban mobility needs. The version being exhibited is the commercial FOXTRON BRIA model, which officially launched in Taiwan this year.

AI infrastructure is another key focus of Foxconn’s exhibition. The company will showcase its modular data center designed for AI factories. Featuring standardized and modular design, it integrates core subsystems including IT equipment, power supply, cooling, and liquid cooling, enabling enterprises to rapidly deploy highly scalable AI computing infrastructure. (Editor: Chang Chun-mao)