Diode manufacturer Actron announced on the 26th that it is actively laying out its strategy for AI power application discrete components and customized modules, with a focus on capturing the high-voltage direct current (HVDC) module market. During an online investor conference, Actron noted that AI power applications are driving demand for HVDC modules, and the trend toward using silicon carbide (SiC) and gallium nitride (GaN) power components is favorable for the company. With years of experience in high-end chip packaging, Actron is well-positioned for future integration of HVDC modules with solid-state transformers (SST). The company expects 70% to 80% of its high-end power components for AI battery backup units (BBU) and power supply units (PSU) to be ready by the end of this year. It aims to increase shipments quarterly by 2027 and remains optimistic about market penetration over the next decade.

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  • Source: CNA (Central News Agency)
  • Category: business
  • Dates in source: 2027