Exhibition Overview and Highlights of the Panasonic Industry Booth at JPCA Show 2026

Panasonic Industry Co., Ltd. will exhibit at the "JPCA Show 2026" held at Tokyo Big Sight from June 10 (Wed) to June 12 (Fri), 2026.

The company will showcase its "FineX(R)" transparent conductive film utilizing proprietary fine-wiring technology, and the "FineX(R) fine wiring with carrier for semiconductor packages" (development product), which applies "FineX(R)" technology. The newly developed fine wiring for semiconductor packages achieves both high-frequency performance and mounting stability through high-precision and smooth Cu (copper) wiring formation technology with a line width of 2–10 μm, contributing to the evolution of next-generation semiconductor packages.

In addition, at the exhibitor seminar on June 10, 2026, the company will introduce a new approach using "FineX(R) fine wiring with carrier" to achieve both high-frequency support and miniaturization using existing PCB processes and film-type substrate materials.

Exhibition Name: JPCA Show 2026 Dates: June 10 (Wed) – June 12 (Fri), 2026 Venue: Tokyo Big Sight, East Exhibition Hall, East Hall 7 Booth Number: 7C-03

"FineX(R) Fine Wiring with Carrier for Semiconductor Packages" (development product) This product applies the fine-wiring technology of "FineX(R)," developed through our proprietary method, to semiconductor packaging. It stabilizes the line width and thickness of Cu wiring, improving high-frequency performance. With smooth wiring surfaces created by the etching-less method and low-warp structures utilizing glass carriers, it contributes to high-speed transmission, low loss, and high-density mounting.

"FineX(R)" Transparent Conductive Film This is a transparent conductive film that achieves both high transparency and low resistance through fine Cu mesh wiring. It can be developed for a wide range of applications such as transparent heaters, antennas, and shields.

Seminar Information Date and Time: June 10, 2026 (Wed) 14:00–15:00 Venue: Seminar Hall 11 Theme: High-Frequency and Miniaturization Support for Printed Circuit Boards Using Existing PCB Processes & Film-Type Substrate Materials