TOPPAN to Exhibit at 'Total Solution Exhibition for Electronic Equipment 2026'

TOPPAN Inc., a group company of TOPPAN Holdings, will exhibit at the 'Total Solution Exhibition for Electronic Equipment 2026' to be held at Tokyo Big Sight from June 10 to 12, 2026. This exhibition is widely recognized both domestically and internationally for showcasing the latest solutions in electronic circuits, mounting technologies, sensors, and wearable tech. At the TOPPAN booth, under the theme 'TOPPAN's Semiconductor Packaging Solutions,' the company will introduce next-generation technologies such as FC-BGA substrates, glass core FC-BGA substrates, damascene process organic RDL, and glass panel substrates. The exhibit will focus on advanced LSI technologies for data centers and network equipment, including large-scale FC-BGA for chiplet structures and substrates for Co-Packaged Optics (CPO).