MECCANISMO・LAB Develops Fully Automatic 6-Inch Wafer Bonding System at 120°C and Atmospheric Pressure

MECCANISMO・LAB Co., Ltd. has developed a fully automatic wafer bonding system compatible with 6-inch wafers, utilizing low-temperature, atmospheric pressure bonding technology developed by NIMS. The device successfully demonstrated bonding at 120°C and atmospheric pressure, eliminating the need for traditional high-temperature and high-vacuum environments. This advancement is expected to benefit heat-sensitive and heterogeneous material bonding in semiconductor packaging, power devices, MEMS, and sensors.