Molex Announces Next-Generation Automotive Ethernet Connector System HSAutoLink G to Meet Rising ADAS/Computing Demand and Zonal Architecture

- Delivers up to 25Gbps differential (STP/UTP) multi-gig automotive Ethernet performance, supporting ADAS, LiDAR, zonal architecture, and central computing modules

- Builds on a proven track record of over 700 million HSAutoLink connectors and cables delivered since 2008, enhancing system integration and supply chain flexibility through USCAR-compliant design

- Addresses industry challenges with stub-proof terminal design for improved mating quality and reversible housing shroud for enhanced installation and wiring flexibility

Lisle, Illinois – July 16, 2026 – Molex, a global leader in electronics and connectivity innovation, announced the expansion of its HSAutoLink interconnect portfolio, which has delivered over 700 million connectors to the automotive industry since 2008. The new Molex HSAutoLink G connector system delivers up to 25Gbps of multi-gigabit Ethernet connectivity through a compact, USCAR-compliant interface, making it ideal for meeting rising bandwidth demands driven by the proliferation of advanced driver assistance systems (ADAS), radar, LiDAR, zonal architecture, immersive displays, and central computing modules.

"As the automotive industry transitions to software-defined vehicles (SDVs), manufacturers must overcome significant performance bottlenecks while ensuring high connection reliability," said Min Kong, Regional General Manager, Connected Mobility Systems (CMS) at Molex. "The HSAutoLink family has served as a reliable foundation for vehicle architectures for nearly two decades. Building on this legacy, the new HSAutoLink G system provides OEMs with a proven upgrade path, enhancing supply chain flexibility and resilience while accelerating time-to-market."

Design Flexibility and High Reliability

Designed to align with existing USCAR Ethernet interfaces, the Molex HSAutoLink G connector system enables easy system integration and upgrades while allowing for flexible, future-ready product designs that support space-saving and lightweight compact modules. Advanced electromagnetic interference (EMI) shielding and controlled differential impedance maintain signal integrity in high-density environments, preventing signal disruptions, validation delays, and costly design re-spins.

Furthermore, the latest addition to the Molex HSAutoLink family features a stub-proof design that protects contacts during mating, reducing the risk of mis-mating. As part of rigorous automotive-grade validation efforts, Molex has added multiple uniformly distributed ground contacts to enhance EMI suppression and improve performance reliability.

Enhanced Supply Chain Flexibility

Comprising terminals, connectors, printed circuit board (PCB) headers, and cables, the new Molex HSAutoLink G family fully complies with the industry-standard USCAR footprint, offering automotive OEMs and Tier 1 suppliers procurement flexibility. This standardized compatibility is supported by Molex’s global manufacturing footprint and comprehensive engineering support. Additionally, extensive real-world simulations and reliability testing are conducted to optimize performance under the most demanding conditions.

Accelerating Innovation

Molex serves as a critical alternative connector supplier meeting high-quality standards for fast-moving, high-volume production markets like China, and is gaining adoption globally as the transition to 25G automotive Ethernet accelerates. This growing adoption reflects Molex’s commitment to simplifying increasingly complex vehicle electronic architectures. By combining high-speed automotive communication protocol solutions like HSAutoLink G and Molex HFM with advanced technologies such as the Molex MX-DaSH connector system, Molex seamlessly integrates power, signals, and ultra-high-speed data transmission into compact, unified architectures.

Leveraging Automotive Connectivity Expertise

The Molex HSAutoLink family has evolved from HSAutoLink to HSAutoLink II, HSAutoLink C, and now HSAutoLink G, long recognized as the benchmark for robust, high-speed automotive connectivity. By supporting up to 25Gbps Ethernet connectivity, Molex further extends this proven legacy, strengthening automotive environmental validation to meet the high-bandwidth demands of future SDVs and autonomous mobility platforms. Product samples of HSAutoLink G are being rolled out progressively to enable early qualification assessments and design-in trials.

About Molex

Molex enables a connected world by making transformative technologies that deliver a more enriching future for all. With operations in more than 38 countries, Molex advances innovation through pioneering technology in consumer devices, aerospace and defense, data centers, cloud, telecom, transportation, industrial automation, and healthcare. Through trusted relationships with customers and industries, unmatched engineering expertise, and product quality and reliability, Molex pursues infinite possibilities. Creating Connections for Life – envisioning a connected future beyond solutions. For more information, please visit www.molex.com.