DASAN Expands Taoyuan Phase IV and V Facilities, Adding Over 1,000 Units Monthly to Next-Gen Server Rack Capacity

DASAN, a leading provider of server chassis and advanced thermal solutions, is proactively expanding production capacity to meet the explosive demand for AI-driven high-density computing and the global race to build hyperscale data centers. The company plans to increase monthly output of next-generation high-density computing server racks by over 1,000 units. The Phase IV facility in Bade, Taoyuan, has completed its main structural construction and will now accelerate progress toward a year-end completion target. Simultaneously, construction of the Phase V plant is scheduled to begin within the year, enabling DASAN to serve a broader customer base.

The Phase IV facility in Taoyuan's Bade district is set for completion by year-end, featuring five above-ground and two underground floors, with a total floor area exceeding 24,000 ping. The building is specifically engineered for next-generation AI server production lines focused on high-density computing, incorporating high-load-bearing floors, optimized high-density server layouts, dedicated product testing zones, and logistics flow paths designed for precision server rack shipping—integrating into a highly efficient production and delivery center.

Due to continuously rising customer demand forecasts, DASAN has accelerated its next-phase expansion plan. The Phase V facility, also located within the Bade Industrial Park, will commence construction this year. With a total usable floor area of nearly 10,000 ping, the combined completion of Phases IV and V will significantly enhance the R&D and manufacturing capabilities at the Taoyuan Bade campus. This will enable DASAN to offer turnkey (Turnkey) design and manufacturing services from Level 6 (L6) to Level 10 (L10) and Level 11 (L11), delivering seamless integration from blueprint design to on-site data center deployment, shortening product development cycles, and enabling rapid mass production, delivery, and deployment into computing workloads.

Facing the industrial challenges brought by the AI application boom, DASAN has extended its 30 years of expertise in chassis craftsmanship into thermal management and server infrastructure structural design. Leveraging its ultra-customizable hardware manufacturing capabilities, the company delivers comprehensive solutions for next-generation server racks, meeting customers’ needs for vertical integration, flexible design, and rapid production.

DASAN’s vertical integration spans from L6-level chassis structure and thermal design, through complete L10-level system assembly, to full L11-level rack-level hardware-software integration, verification, and stress testing (pre-integration and validation phase). With agile engineering capabilities, DASAN adapts swiftly to evolving AI architectures—such as advanced liquid-cooled manifolds and complex power distribution layouts—responding rapidly to customer design changes and dynamic adjustments.

DASAN confirms it is already prepared to increase monthly shipments of next-generation server racks by over 1,000 units. As the Phase IV and V production capacities come online and mature, the new facilities will meet diverse computing ecosystem demands, including public cloud datacenter customers, for whom DASAN can provide high-integration L10/L11 hardware services tailored to mission-critical needs.

For enterprise and hybrid cloud customers, DASAN offers rack systems designed for compute-intensive, high-security, and high-durability environments. For telecom and edge computing applications, it supports rapid deployment of localized edge clusters to serve smart cities, autonomous driving, and private 5G/6G networks in manufacturing.

DASAN also provides high-performance computing (HPC) solutions specifically engineered for national research laboratories and supercomputers, capable of bearing extreme structural loads and supporting advanced liquid cooling infrastructure. For large-scale colocation data centers, DASAN delivers robust pre-assembly systems and high-efficiency logistics networks to enable fast, large-volume hardware delivery.