Hung Su and Germany's Singulus Deepen Collaboration to Capture Panel-Level Packaging Opportunities

Hung Su (3131-TW), a manufacturer of wet-process equipment for semiconductor advanced packaging, has announced a deep strategic collaboration and technology integration initiative with Singulus Technologies of Germany, focusing on the semiconductor advanced packaging sector, particularly in the next-generation 'Panel-Level Packaging (PLP)' technology.

According to reports, Hung Su's CEO, Hong-Tai Chang, along with the core senior management team, personally visited Singulus's headquarters in Kahl am Main, Germany, in July this year. During this meeting, both parties' top executives reached a consensus on strategic cooperation.

Hung Su stated that Singulus possesses unparalleled years of mass production experience and an outstanding sales track record in horizontal and vertical PVD (Physical Vapor Deposition) sputtering equipment for large panels. Their equipment supports a wide range of sizes from 300mm x 300mm to 2,000mm x 2,000mm and has long maintained a global technological leadership position in high uniformity, low particle contamination control, and high productivity.

This strategic alliance will integrate Singulus's advanced PVD thin-film deposition technology, Hung Su's specialized wet-process equipment, and the distribution and local service capabilities of Jia Lin Technology—Hung Su's subsidiary with years of experience in semiconductor equipment agency. Together, they will form a 'Golden Triangle' collaboration model, providing global semiconductor advanced packaging customers with the most comprehensive, reliable, and cost-effective one-stop integrated solutions.

Markus Ehret and Lars Lieberwirth, co-CEOs of Singulus, stated, 'As the semiconductor industry accelerates its evolution toward PLP and advanced packaging technologies, this close strategic partnership will better showcase Singulus's technological advantages in large-area PVD coating. By perfectly integrating German advanced hardware technology with top-tier Asian process services, we will jointly create a new landscape in the advanced packaging market.'