Amid South Korean President Lee Jae-myung's attendance at the AI Summit in San Francisco, Samsung Electronics and SK Hynix have jointly announced historic semiconductor collaborations with major U.S. technology firms. The combined value of these two deals reaches 1,375 trillion Korean won (approximately $950 billion), marking a new phase in strategic alignment within the global AI supply chain.
SK Group and U.S. AI chip leader NVIDIA signed a memorandum of understanding (MOU) on Friday (24th), launching a comprehensive collaboration exceeding $500 billion. As part of this, SK Telecom will construct an 'AI Factory' in South Korea equipped with the Vera Rubin DSX architecture and a capacity of 2GW. The first facility is scheduled to begin operations in 2027. Meanwhile, SK Hynix has established a long-term partnership with NVIDIA to jointly ensure supply and co-develop next-generation AI memory, including HBM4, covering applications from large model training to agentic AI and physical AI.
Simultaneously, Samsung Electronics announced a five-year MOU with Broadcom, aiming to surpass $200 billion in cooperation by 2030 across advanced memory, foundry services, and advanced packaging.
In memory, Samsung will support Broadcom’s next-generation AI accelerators. In foundry, Samsung will provide sub-2nm process technology for wireless broadband and custom ASICs. Samsung and Broadcom will also expand collaboration into 2.3D and 2.5D advanced packaging to develop more energy-efficient AI and networking chips.
Analysts note that these agreements go beyond simple procurement, forming an integrated 'HBM supply—advanced process—AI data center' alliance. This allows NVIDIA to secure production capacity, Broadcom to enhance ASIC and packaging capabilities, and Korean firms to obtain long-term orders and opportunities for process upgrades. As a result, South Korea is becoming more deeply embedded in the core of the global AI computing supply chain.
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- Source: PR Times
- Category: Partnership
- Organizations: NVIDIA