Young Po Technology (2493-TW), a supplier of PCB and semiconductor equipment and consumables, announced its latest self-reported financial results today (31). In June 2026, Young Po achieved a record-high revenue of NT$406 million, with a self-reported monthly net profit of NT$90 million, up 42.86% month-on-month and 84.32% year-on-year. The monthly earnings per share (EPS) stood at NT$0.71. Combined with May's net profit of NT$63 million, the cumulative net profit for May and June reached NT$153 million, approaching the first-quarter total of NT$159 million.

The cumulative net profit for May and June 2026 amounted to NT$153 million, or NT$1.20 per share. The second quarter is expected to surpass both the first quarter of 2026 (NT$159 million) and the same period last year (NT$52 million). Performance in the second half of 2026 is projected to exceed that of the first half.

In terms of in-house equipment development, Young Po is focusing on thick-panel, high-end substrate, and future glass substrate process equipment to meet the manufacturing demands of the high-end product market. For its agency product segment, the company is currently concentrating its business efforts on semiconductor advanced packaging and photolithography processes.

Additionally, Young Po has completed the establishment of a subsidiary in Thailand to serve PCB manufacturers investing overseas. The Thai subsidiary also mentioned providing services to Taiwanese businesses operating in Vietnam.

As a company primarily focused on in-house wet process equipment, Young Po is advancing the development of equipment for thick panels, high-end substrates, and future glass substrates in the PCB sector. With various PCB manufacturers entering the high-end product competition—including 5G-related substrates, system-in-package (SiP) substrates, HDI, flexible circuit boards, and equipment for smart electric vehicles and safety-related PCBs—Young Po is aligning its offerings to meet these growing demands.

In the agency product segment, Young Po is currently focusing on collaboration within the semiconductor advanced packaging and photolithography process domains. The materials business is accelerating certification processes with major semiconductor manufacturers in Taiwan and overseas.

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  • Source: PR Times
  • Category: 財務業績