The National Science and Technology Council (NSTC) announced today (4th) the approval of five investment cases during its 34th committee meeting, with one case confidential. The total investment amounts to approximately NT$4.158 billion. Additionally, 15 capital increase cases were approved, totaling NT$15.695 billion in additional funding. Among the new entrants, two companies will enter the Taichung Park, one each in Yilan and Tainan Parks, and another at a non-disclosed location. All publicly disclosed investment cases are related to the semiconductor industry, including Haodeng Intelligent Technology, Yat Shing Technology’s Southern Taiwan Science Park Branch, Xintai Enterprise, and Fengrong Smart Machinery.

Of the four companies, Fengrong Smart Machinery is establishing operations in the Central Taiwan Science Park (CTSP), investing NT$50 million. Its main products include intelligent packaging systems for finished semiconductor wafers, inspection equipment for wafer transfer boxes, automated logistics and warehouse solutions, and automation equipment for semiconductor packaging and testing processes. The company specializes in R&D of intelligent automation equipment and system integration, launching a wafer packaging system that integrates high-precision transportation with AI-based visual inspection.

Haodeng Intelligent Technology secured an investment of NT$20 million and will enter the Hsinchu Science Park’s Yilan Campus. The company’s product is a 'Smart Logistics and Manufacturing Collaboration System' built on a microservices architecture. Using hardware-software decoupling technology, it transforms traditional rigid warehouse equipment into dynamic resources capable of AI-driven autonomous decision-making. It offers services including smart warehouse management systems, material and equipment control systems, intelligent decision-making engines, 3D digital twin dashboards, and smart logistics consulting and integration.

The NSTC stated that this project is positioned around 'software-defined logistics,' with a key advantage being the integration of IT and OT systems. It holds significant application value for Taiwan’s semiconductor, PCB, precision components, electronics manufacturing, and third-party logistics industries. This aligns with the government’s policy on six core strategic industries, particularly smart manufacturing and information security.

Xintai Enterprise received an investment of NT$15 million and is setting up in CTSP. Its primary products include semiconductor equipment hardware and process optimization, refurbishment of used semiconductor machinery, next-generation high-purity silicon consumable components, and design and manufacturing of advanced Atomic Layer Deposition (ALD) process chambers.

The NSTC noted that by entering CTSP, the company will integrate international intelligence with domestic academic-industrial-research R&D capabilities to build a self-sustaining technical chain with carbon reduction benefits, thereby substantially strengthening the localization and resilience of Taiwan’s high-end semiconductor core supply chain.

Yat Shing Technology’s Southern Taiwan Science Park Branch will be established in the Tainan campus of the Southern Taiwan Science Park. The NSTC indicated that the company plans to set up a research and development center in Tainan, focusing on developing next-generation advanced packaging equipment. Products include glass via etching equipment and double-sided electroplating equipment, addressing market demands from AI, high-performance computing, and panel-level packaging.

The NSTC stated that after entering the park, the company will stay close to customer needs, deepen joint R&D and technology verification, drive localization and domestic production of key semiconductor equipment, and enhance the industry’s international competitiveness.

FACT BOX

  • Source: PR Times
  • Category: Funding