Dewi (3675-TW) announced today (4th) July revenue of NT$291 million, up 3.97% month-on-month and 29.78% year-on-year, setting a new monthly revenue record. Cumulative revenue for the first seven months reached NT$1.776 billion, up 19.02% year-on-year. Dewi stated that strong customer demand and rising shipments of high-value products drove July's record revenue. In Q2, optimized product mix lifted gross margin back to 40%, the second-highest in company history, with earnings per share (EPS) reaching NT$2.

Q2 revenue was NT$801 million, up 16.99% quarter-on-quarter and 24.52% year-on-year. Gross margin reached 40.8%, up 2.5 percentage points quarter-on-quarter and 8.2 percentage points year-on-year. Operating profit was NT$141 million, up 38.05% QoQ and 554.49% YoY. Net profit after tax was NT$106 million, up 32.5% QoQ and 322.36% YoY, with EPS at NT$2.

H1 revenue totaled NT$1.486 billion, up 17.11% YoY. Gross margin was 39.6%, up 4.4 percentage points YoY. Operating profit was NT$243 million, up 142.15% YoY. Net profit after tax was NT$186 million, up 611.17% YoY, with EPS at NT$3.51.

Cumulative H1 revenue reached NT$1.485 billion, with gross margin rising to 40%. Net profit after tax was NT$186 million, up 611% YoY, and EPS was NT$3.51, with both revenue and profitability rising in tandem.

Dewi noted that strong demand from AI applications, automotive electronics, and industrial control products, combined with customer inventory replenishment and increased shipment share of high-value products, has driven overall business expansion and full-capacity utilization. In response to sustained end-market demand growth, Dewi is actively advancing product upgrades and deepening cooperation with domestic and international customers to capture growth opportunities in the power semiconductor industry.

In recent years, Dewi has deepened its IDM (Integrated Device Manufacturer) strategy. Subsidiary Yasin Technology handles wafer manufacturing, Dewi focuses on power component packaging, and sales channel subsidiary Kicos expands market reach, building a vertically integrated system covering wafer fabrication, packaging, and sales. This enhances product development, capacity allocation, and customer service, with synergies gradually reflected in operational performance.

Dewi believes that as the global semiconductor supply chain restructures and customers increasingly demand diversified supply sources, the company will continue to strengthen its international competitiveness through in-house manufacturing, quality control, supply flexibility, and product customization, accelerating its push into high-value-added product applications.

Looking ahead to the second half, Dewi stated that with high-margin products gradually scaling up, the company will continue optimizing product mix and operational efficiency, actively pursuing new customers and partnerships arising from global supply chain adjustments, and expressed strong confidence in second-half performance.

Additionally, subsidiary Yasin Technology has initiated public share issuance and plans to list on the GreTai market. Going forward, the group will leverage specialized division of labor across subsidiaries to maintain upstream-downstream synergy while enhancing operational autonomy and market expansion capabilities of each business unit, injecting long-term growth momentum into the group.

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  • Source: PR Times
  • Category: 財務報告