Tongtech Reports Strong First-Half Earnings with EPS of NT$0.52, Appoints Lucy Yen as GM to Drive AI and Advanced Packaging Initiatives

Tongtech Technology (8064-TW) announced its 2026 first-half financial results on August 4, benefiting from effective operational restructuring. Cumulative revenue reached NT$1.227 billion, up approximately 20% year-on-year, with post-tax earnings per share (EPS) reaching NT$0.52. To seize explosive business opportunities in the global semiconductor equipment market, Tongtech has launched a key leadership transition. The board approved CEO Lucy Yen's concurrent appointment as General Manager, enabling unified oversight of operations and business upgrades. This follows earlier confirmation of Leon Liang as Chairman, completing a new senior management lineup poised to execute a 'dual-pronged' strategy focused on AI and advanced packaging equipment markets.

Tongtech's consolidated revenue for the first half totaled NT$1.227 billion, representing a 19.1% year-on-year increase. Gross margin stood at 27.38%, up 15.08 percentage points from the previous year. Post-tax net profit reached NT$90.596 million, turning profitable compared to the same period last year, with EPS at NT$0.52.

To precisely align with the growth wave in the semiconductor equipment market, Tongtech is simultaneously advancing high-level organizational restructuring. In May, founding chairman Ray Yen established a foundation for corporate transformation before passing the chairmanship to Leon Liang. On August 4, the board further approved CEO Lucy Yen's concurrent role as General Manager, enabling comprehensive oversight of overall operations and business upgrades.

Meanwhile, former General Manager Chen Tsan-jen has moved to the Chairman's Office, where he will leverage his extensive production and process expertise to advance strategic alliance initiatives and expand the company's long-term development framework.

Looking ahead, Tongtech will deepen its positioning through a 'dual-pronged' strategy. First, it will integrate the technological advantages of 'G2C + Alliances' to build a collaborative platform called the 'S Corridor Diamond Chain,' linking semiconductor clusters in Tainan, Kaohsiung, and Chiayi, providing localized real-time technical support.

Second, the company will continue advancing R&D in key equipment such as Laser Trimming, Laser Debonding, Laser Grooving, and Laser Cutting, significantly expanding its strategic footprint in the AI and advanced packaging equipment markets, injecting new momentum into long-term profitability.