〈SEMICON〉SEMI Voices Semiconductor Testing and Measurement Industry for the First Time, Proposing Three Key Demands

SEMICON Taiwan is set to take place in early September, and today (12th), a pre-event forum was held. Alex Chu, SEMI's Chief Marketing Officer and President of Taiwan, stated that Taiwan already holds a leading advantage in advanced processes and advanced packaging. Each technological breakthrough relies on collaborative innovation across the supply chain, and testing and measurement have become critical in determining yield, cost, and mass production efficiency. Therefore, SEMI is presenting three key recommendations to the government: dedicated policy support, talent cultivation, and a shared platform for advanced testing equipment. The association urges the government to further integrate testing and measurement into strategic planning and jointly seize the industrial opportunities brought by AI.

SEMI pointed out that Taiwan possesses world-class supply chain integration and mass production capabilities. The next step requires closer collaboration between industry and government to deepen this advantage and make it more visible globally. SEMI will continue to act as an industry connector, building consensus and facilitating dialogue to help the industry position itself for the future and capture new opportunities in the AI era.

SEMI emphasized that the key to AI chip supply lies not only in wafer production capacity but also in whether advanced packaging, testing, and measurement capabilities can keep pace. As process nodes continue to shrink and chip and packaging architectures grow increasingly complex, testing must not only verify functionality and performance but also ensure they meet specifications. Measurement, in particular, must precisely capture process parameters and minute deviations. With the rising value and complexity of AI chips, testing and measurement are moving from behind-the-scenes support to the forefront, becoming a critical factor in determining yield, performance, and mass production speed in advanced processes.

To this end, SEMI International Electronics Industry Association hosted its first-ever 'AI Era Semiconductor Testing and Measurement Industry Insights and Advocacy Press Conference,' led by Alex Chu, SEMI's Chief Marketing Officer and President of Taiwan. The event featured Chi Mei Electronics (2360-TW) CEO and President and SEMI Testing and Metrology Committee Chairperson Zeng Yi-shi, and King Yuan Electronics (2449-TW) CEO Zhang Gao-xun, who shared industry insights from the perspectives of measurement equipment and testing services, respectively. Over 20 industry representatives attended the event.

Prior to the conference, SEMI conducted a survey across the semiconductor supply chain, including IC design, wafer manufacturing, testing services, and inspection and measurement equipment companies. The results showed a high degree of consensus within the industry on three key directions: dedicated policy support, academic programs aligned with testing talent needs, and shared access to advanced testing equipment. The industry hopes the government will further incorporate testing and measurement into strategic planning to jointly capture the industrial opportunities brought by AI.

The revaluation of testing and measurement is reflected in market growth trends. According to SEMI's forecast, global semiconductor equipment sales are expected to rise from $135 billion in 2025 to nearly $230 billion by 2028. Testing equipment, in particular, is seeing strong growth, with sales projected to surge 31% to $15.3 billion in 2026 and further climb to $20.8 billion by 2028. The Taiwan market is also demonstrating strong growth momentum.

Latest data from the Ministry of Economic Affairs' Statistics Division shows that last year's measurement industry output reached NT$193.6 billion, a record high. In the first five months of this year, output grew 32.8% year-on-year. This growth is primarily driven by increased testing intensity from advanced logic, HBM, and high-performance computing, fueling rising demand for memory testing, system-level testing (SLT), burn-in testing, and reliability screening.

Taiwan's complete and highly integrated semiconductor ecosystem provides testing and measurement providers with advantages in supply chain collaboration, mass production efficiency, and rapid response. SEMI's survey shows that, compared to the U.S., Japan, South Korea, and Europe, industry players highly recognize Taiwan's competitiveness in tight integration with foundries and OSATs (96.4%), mass production testing efficiency and cost control (71.4%), and rapid customization with flexible delivery timelines (67.9%), collectively shaping a 'fast, integrated, reliable' global positioning.

However, facing a new wave of growth opportunities from AI, the industry is seeking further upgrades. The survey shows that, compared to three years ago, participation in international standards remains relatively limited, and the industry desires continued enhancement of R&D and original technology capabilities. Over 40% of companies (42.3%) hope for government assistance in participating in international standards organizations. Looking ahead, Taiwan must not only strengthen forward-looking technology R&D but also expand its participation and influence in international standards, evolving from a world-class supply chain partner to a defining force in next-generation testing and measurement technologies and standards.

SEMI's survey indicates that AI has become the primary growth driver for testing and measurement businesses, with over 90% of companies expecting related business to continue growing over the next three years. As AI chips demand higher performance, the industry's requirements for measurement precision and testing speed have simultaneously increased significantly. The role of testing is also extending from back-end quality control to front-end R&D, with half of the respondents believing testing should be involved earlier in design and design-for-testability/manufacturability (DFT/DFM) processes. In terms of technology investment, industry priorities are aligned, with advanced packaging testing (CoWoS/SoIC) and photonic measurement (silicon photonics) ranking as the top two focus areas.