Xiaomi Unveils Next-Gen In-House Chip Xring O3, TSMC 3nm Fabrication, Targeting Flagship Foldables

Xiaomi (01810-HK) unveiled its next-generation in-house flagship smartphone processor, the 'Xring O3,' on Monday (24th), demonstrating its commitment to expanding self-developed chip initiatives and enhancing supply chain autonomy.

Zhu Dan, Vice President of Xiaomi's Engineering Division, revealed preliminary details of this flagship system-on-chip (SoC) during an online livestream on August 23. This chip follows the 2025 launch of the Xring O1 and represents Xiaomi's latest strategic move to reduce reliance on suppliers such as Qualcomm (QCOM-US) and MediaTek (2454-TW).

According to Reuters, the chip will utilize TSMC's (2330-TW)(TSM-US) 3-nanometer technology, with a shipment target of 200,000 to 300,000 units. As the related plans have not yet been made public, sources familiar with the matter declined to be named. Neither Xiaomi nor TSMC has responded to inquiries regarding the chip manufacturer, production technology, or shipment targets.

In terms of technology and performance, Abid Ahsan Shanto, Senior Technology Writer at Notebookcheck, noted that while the Xring O3, using 3nm fabrication, lags slightly behind competitors like Qualcomm and MediaTek—whose next-generation chips are expected to adopt TSMC's 2nm process—it still achieves significant breakthroughs in performance and efficiency.

Shanto indicated that the chip is expected to operate at frequencies exceeding 4GHz, delivering superior energy efficiency. It is anticipated to be featured in Xiaomi's next-generation flagship foldable smartphones, the Pad 8S Pro tablet, or the Xiaomi 18 Ultra.

During last week's earnings call, Xiaomi stated that since the previous-generation Xring O1 launched in May 2025, smartphone sales with the chip totaled approximately 150,000 units, and cumulative shipments across various devices have surpassed one million units.