TSMC and AMD Unveil Next-Gen Cold Plate Technology, Mass Production Expected Mid-2025

AI chip power consumption continues to rise, making thermal management a critical bottleneck. TSMC (2330-TW)(TSM-US) and AMD (AMD-US) today jointly unveiled their next-generation liquid cooling technology roadmap, including the integration of packaging and cold plates through TIM less technology. Industry sources indicate that thermal and equipment suppliers such as Twinhead (3324-TW), AcBel (3017-TW), Kenchic (3653-TW), and Hongten (7751-TW) have already joined the development. The new cold plate solution is expected to enter mass production as early as mid-next year, capturing the next wave of AI liquid cooling upgrade opportunities.

AMD stated today regarding next-generation AI thermal solutions: 'Thermals is becoming a bottleneck,' introducing its Lidless Package technology. By eliminating the lid and TIM2 layer, the heat dissipation path is shortened, improving cooling efficiency. AMD also listed Cold Plate Lid, Backside Jet Cooling, and Si Micro fluidics as potential future thermal architectures.

TSMC emphasized that to prevent AI systems from hitting a 'thermal wall,' the ultimate goal is to eliminate thermal interface materials entirely (TIM less), enabling direct contact between the cold plate and the chip. Compared to current designs, where heat must pass through TIM, lid, and another TIM layer before reaching the cold plate, integrating the cold plate directly into the package will significantly shorten the thermal path and reduce thermal resistance—meeting the cooling demands of next-generation multi-kilowatt AI computing modules.

Industry insiders note that the current TIM less process differs from existing methods. First, the stiffener and removable lid are attached at advanced packaging facilities. Then, at system assembly plants, the lid is removed and the cold plate is secured, allowing seamless integration into downstream manufacturing processes.