Who is the seminar intended for?

It is intended for young hardware designers and project managers who want to establish thermal management for electronic devices.

What will we learn in the seminar?

We will systematically learn practical thermal design methods, from the three principles of heat to heat reduction at the circuit and board level, selection of TIM (thermal interface materials) in structural design, and thermal simulation (CAE).

When and how can I attend?

The in-person and live stream sessions are on July 13, 2026, from 10:00 to 16:00. The archive stream will be available from July 15 to July 29, 2026.

Who are the instructors?

The instructors are Takashi Suzuki, CEO of Kamikami Corporation, and Takashi Taru, Circuit Technology Advisor.

What is the registration fee?

The fee is 49,500 yen (including tax) per person. Discounts are available for multiple attendees.

Practical Seminar on Thermal Management for Electronic Devices: Bridging Circuit and Mechanical Design

Published May 26, 2026 8:00 PM ・ Updated Jun 14, 2026 8:04 AM ・ 3 min read ・ Source: PR TIMES

The IR Technical Education Institute will host a thermal management seminar on July 13, 2026, featuring expert instructors from Kamigami Corp, focusing on integrated circuit and mechanical heat mitigation.

The IR Technical Education Institute is hosting a public seminar that provides practical, essential countermeasures for thermal management from both board/circuit design and mechanical/structural design perspectives. As electronic devices become increasingly dense and compact, balancing performance and reliability while managing heat dissipation is a critical challenge. This seminar focuses on fundamentally organizing design principles and learning reproducible thermal management strategies.

Seminar Overview Seminar Title: Thermal Management Clinic for Electronic Devices: A Dual Approach through Circuit and Mechanical Design Format: In-person / Live streaming / Archived stream Location: In-person at Japan IR HQ / Online via Zoom Date & Time: Monday, July 13, 2026, 10:00–16:00 (Archive available July 15–July 29) Tuition: 49,500 JPY (tax included) per person Instructors: Takashi Suzuki, Takashi Tago (Kamigami Corporation)

Key Program Highlights: 1. Three Laws of Heat and Current Trends 2. Thermal Design in Circuits and Boards 3. Circuit Malfunction Case Studies 4. Measurement Techniques for Real Devices 5. Structural Thermal Design (TIM selection, etc.) 6. Thermal Structural Design Failure Analysis 7. Thermal Simulation (CAE)

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Practical Seminar on Thermal Management for Electronic Devices: Bridging Circuit and Mechanical Design

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