AI Material Procurement Boom Fully Ignites! Taisotec Q2 Revenue Breaks 20 Billion TWD for the First Time, EPS Hits Record High of 7.92 TWD

Demand for AI and high-performance computing (HPC) continues to ripple upstream from chip manufacturing to the materials supply chain, boosting procurement of photoresists, silicon wafers, quartz, wafer carriers, and polishing slurries. Semiconductor materials and engineering services provider Taisotec (5434) today released its Q2 financial results, with quarterly revenue surpassing 20 billion TWD for the first time, reaching 20.83 billion TWD. Earnings per share (EPS) also rose to 7.92 TWD, setting new quarterly records for both revenue and EPS.

Notably, Taisotec’s net profit attributable to owners of the parent in Q2 increased nearly 68% year-on-year, a growth rate significantly higher than revenue growth. This propelled first-half EPS to 14.79 TWD, also a historical high. Looking ahead to the second half of the year, as foundries continue to ramp up advanced process and advanced packaging capacities, Taisotec anticipates sustained demand for related materials and facility engineering, and will expand its semiconductor supply chain presence in the U.S., Japan, and Southeast Asia in line with key customers’ overseas factory construction.

Q2 revenue up 22.6% YoY, net profit grows even faster

Taisotec’s consolidated Q2 revenue reached 20.83 billion TWD, up 12.3% quarter-on-quarter and 22.6% year-on-year—marking the first time it has crossed the 20 billion TWD threshold and setting a new quarterly record. Net profit attributable to owners of the parent reached 1.54 billion TWD, up 16% QoQ and 67.8% YoY. Quarterly EPS was 7.92 TWD, higher than Q1’s 6.86 TWD, marking two consecutive quarterly records.

Financially, Taisotec’s net profit growth in Q2 far outpaced revenue growth, indicating that profitability has strengthened alongside expanding operations. However, Taisotec did not elaborate on the specific reasons behind the higher profit growth—such as product mix, cost control, or non-operating gains—which will need to be clarified in future investor briefings or financial reports.

AI and HPC demand spillover drives procurement of five key semiconductor materials

Taisotec noted that Q2 operational growth was primarily driven by sustained global AI and HPC demand, which has spurred foundries and related semiconductor supply chains to expand capacity. This led to simultaneous procurement demand for photoresists, silicon wafers, quartz, wafer carriers, and polishing slurries.

These materials are widely used in wafer manufacturing, advanced processes, and related production stages. As AI chips demand increasingly stringent process technologies, yields, and material specifications, market demand has expanded from computing chips and advanced packaging equipment further upstream to critical materials and facility systems—becoming a key driver supporting Taisotec’s operational growth.

However, Taisotec did not disclose revenue breakdowns or individual growth rates for each product line, so it is currently impossible to determine which material contributed most to Q2 revenue.

First-half revenue nears 40 billion TWD, EPS reaches 14.79 TWD

Cumulatively for the first half of 2026, Taisotec’s consolidated revenue reached 39.36 billion TWD, up 20.2% year-on-year. Operating profit was 2.91 billion TWD, up 35.3% YoY. Net profit attributable to owners of the parent reached 2.86 billion TWD, up 54.2% YoY, with EPS at 14.79 TWD.

Compared to 20% revenue growth, Taisotec’s operating profit grew over 30%, and net profit and EPS surged more than 50% YoY—demonstrating that profit growth significantly outpaced revenue expansion. This allowed the company to continue breaking profit records even on a high base from the same period last year.

Advanced process and packaging expansion to drive second-half materials and engineering demand

Looking ahead to the second half of 2026, Taisotec stated that as foundries continue to ramp up advanced process and advanced packaging capacities, related materials and facility engineering demand will become a key support for operations.

Beyond materials sales, semiconductor fab expansion involves water treatment, facility systems, and related engineering services. Taisotec continues to deepen its semiconductor materials and high-tech engineering businesses, aligning with its foundry customers’ global localization strategies to integrate semiconductor supply chains across Taiwan, the U.S., Japan, and Southeast Asia.

Taisotec expects full-year operations and profitability to continue growing. However, with first-half revenue and profits already setting a high base, the pace of advanced process and packaging capacity ramp-up, progress on overseas fab construction, and whether material procurement momentum can be sustained will be key indicators for whether second-half performance can reach new highs.