TSMC's Appeal Grows! Longtan Residents Shift from Protest to Envy as Southern Economic Boom Inspires Support for 1.4nm Plant

The Hsinchu Science Park originally planned the Longtan Science Park expansion (Longtan Phase III), with TSMC intending to build a 1.4nm semiconductor facility. However, due to local resident protests, the project was delayed for a long time. Ultimately, TSMC announced in 2023 its decision to abandon the Longtan construction plan and shifted its focus to Tainan, Kaohsiung, and Chiayi.

However, according to reports, Longtan residents, having observed the economic benefits brought by TSMC's investments, changed their stance from opposition to support. After discussions, the 'Longtan Phase III' project has been revived.

According to Liberty Times, the original Longtan Phase III plan involved acquiring 158.59 hectares of land for new semiconductor plants. However, since 88% of the land was privately owned, local residents formed a self-help association and protested. In response, TSMC officially announced the cancellation of its Longtan construction plan on October 17, 2023.

But after TSMC proceeded to build factories in Tainan, Kaohsiung, and Chiayi—generating significant regional economic spillover effects—residents in Longtan began to reconsider. A sentiment emerged: 'If TSMC doesn’t come, we can only grow tea on this land.' Following this shift in perception, the Hsinchu Science Park Administration and Taoyuan City government held discussions with residents, eventually restarting the Longtan Phase III project.

Initially, the Hsinchu Science Park Administration proposed reducing the expansion area to 89.63 hectares. However, due to petitions from residents and landowners requesting a larger area, and a softened opposition stance, the final area was adjusted to 104.19 hectares. The plan now includes allocating 46 hectares for industrial use, and two public hearings have already been held.

If the Longtan Phase III plan is formally approved, reports suggest TSMC is considering re-entering the site. The National Science and Technology Council (NSTC) stated that the Longtan Phase III project passed the Science Park Review Committee in May and was submitted to the Executive Yuan in June. The goal is to complete land acquisition by the end of 2029, begin public infrastructure construction in 2030, and then lease industrial land to companies for factory construction.

The Hsinchu Science Park Administration noted that TSMC has expressed willingness to consider进驻 if the Longtan Phase III procedures are completed. Supply chain sources indicate TSMC is planning to build two 1.4nm fabs and one panel-level packaging facility at the site, though the final plan is still under study.