Industry First: Mass Production of 'G785 Series' Encapsulation Material for SiC Power Modules, Achieving World-Class Tg of 230°C

Sumitomo Bakelite Co., Ltd. has developed and started mass production of the 'EME-G785 series,' a solid epoxy resin encapsulation material for next-generation SiC power modules that achieves an industry-first glass transition temperature (Tg) of 230°C. This product balances 'ultra-high heat resistance' and 'low stress,' which were previously considered difficult to achieve simultaneously, contributing to the miniaturization and high output of power modules. The company positions this series as a strategic product, aiming for 10 billion yen in sales by fiscal year 2030.