Tektronix to Exhibit at 'Automotive Engineering Exposition 2026 YOKOHAMA'

Tektronix, Inc. (Location: Minato-ku, Tokyo; Representative Director: Koichi Sega) announced it will exhibit at the 'Automotive Engineering Exposition 2026 YOKOHAMA,' to be held at Pacifico Yokohama from May 27 (Wed) to May 29 (Fri), 2026 (Booth No.: 210).

As the automotive industry undergoes a transformation centered on CASE (Connected, Autonomous, Shared, and Electric), the complexity of measurement continues to rise alongside advancements in electronic technology. At the Tektronix booth, we will introduce a wide range of essential test and measurement solutions for next-generation automotive development, including the latest '7 Series DPO Oscilloscope,' as well as solutions for automotive Ethernet, MIPI, PCIe, and high-power DC-DC converter evaluation.

[Key Exhibits]

- New Arrival: 7 Series DPO Digital Phosphor Oscilloscope Featuring an analog bandwidth of up to 25 GHz, a 125 GS/s sample rate, and 12-bit resolution, this model provides industry-leading signal fidelity for analyzing ultra-high-speed signals, from AI data centers to automotive SoCs.

- Industry First: TICP Series IsoVu Isolated Current Probes & Double Pulse Test Solutions We will showcase a test configuration using the new 'TICP Series IsoVu Isolated Current Probe,' which employs the industry's first RF isolation technology. With a frequency bandwidth of up to 1 GHz and high immunity to fast common-mode voltage fluctuations, it enables previously impossible current measurements. It is optimized for the design and development of SiC/GaN power devices, inverters, and motor drives.

- EV & Power Electronics Evaluation We will showcase the EA brand's lineup of power supplies and electronic loads that support everything from low-power to MW-class systems and high-performance battery testing, including live demonstrations of DC-DC converter evaluation.

- MIPI A-PHY/D-PHY/C-PHY Physical Layer Evaluation Solutions Learn about techniques for reliably evaluating and analyzing complex D-PHY/C-PHY signals that dynamically switch between High Speed and Low Power modes using our oscilloscopes.

- Debugging and Analysis of High-Speed Serial Interfaces With the advancement of autonomous driving and ADAS, high-speed communication has become crucial. We will demonstrate signal quality evaluation techniques, such as eye diagrams and jitter analysis, using PCI Express (PCIe) chip-to-chip measurements.

- Automotive LAN Analysis & Test Solutions In light of the rapid adoption of high-speed, large-capacity communication such as automotive Ethernet, we will showcase solutions supporting a wide range of standards, from the latest CAN XL to MultiGBASE-T1 (10M to 10Gbps+). These solutions significantly reduce the time required for compliance testing and debugging.

[Event Overview] Name: Automotive Engineering Exposition 2026 YOKOHAMA Date: May 27 (Wed) - May 29 (Fri), 2026, 10:00 - 17:00 Venue: Pacifico Yokohama Exhibition Hall North (Booth No.: 210)