[Semiconductor Post-processing] Adoption of 'Paper-based TPS Cleaning Sheet' for Semiconductor Molding Mold Cleaning - Developed through Industry-Academia-Government Collaboration, Now in Use on Actual Manufacturing Lines

Tohoku Logistics Co., Ltd. (Headquarters: Yonezawa City, Yamagata Prefecture; Representative Director: Kenji Maeyama) is pleased to announce that the "Paper-based TPS Cleaning Sheet," developed through industry-academia-government collaboration and corporate alliances, has been officially adopted in the manufacturing process of a major domestic semiconductor manufacturer. It has started being utilized on actual manufacturing lines for cleaning resin molding molds in semiconductor post-processing.

### Background of Development Semiconductors used in smartphones, automobiles, and various electronic devices are manufactured through an "encapsulation process (molding)" where resin is poured into a mold to protect them from the external environment.

In this process, cleaning work is essential to remove resin residue and impurities adhering to the mold surface, and traditionally, metal frames or glass-epoxy substrates have been used.

However, against the backdrop of recent soaring metal material prices and growing demands for improved manufacturing efficiency and reduced environmental impact, the need for new materials and methods to replace these has increased.

### Product Overview and Features This product is a sheet for cleaning semiconductor encapsulation molds, developed based on Tohoku Logistics Co., Ltd.'s paper processing technology.

Despite being made of paper, it possesses the following characteristics required for semiconductor manufacturing processes. In particular, regarding dust-proof performance, which is crucial in precision processes, we have succeeded in suppressing dust generation using our proprietary technology (domestic patent acquired).

- Rigidity: Realizes stable handling within the process - Dust-proof: Suppresses dust generation, reducing the impact on precision processes - Heat resistance: Can be used under encapsulation process conditions (high-temperature environment) - Adsorption: Compatible with transport in automated processes

### Effects of Introduction This product is being operated on actual manufacturing lines, and the following effects have been confirmed:

- Cost reduction of approximately 20 to 30% compared to conventional methods - Reduction of cleaning frequency from about 5 times to about 3 times - Reduction of process load and improvement of work efficiency - Reduction of environmental impact by reducing the use of petroleum-derived materials