ARUM Inc. Issues 1st Unsecured Corporate Bond (Carbon Offset Type) with The Hokuriku Bank

ARUM Inc. (Headquarters: Kanazawa City, Ishikawa; CEO: Hiroyuki Hirayama) has issued its first unsecured corporate bond, known as the 'Hokuhoku Carbon Offset Private Placement Bond,' with The Hokuriku Bank, Ltd. as the underwriter.

### About the 'Hokuhoku' Carbon Offset Bond This framework allows the bank to utilize a portion of the fees received from the issuing company for regional carbon offset initiatives. It enables companies to raise funds while simultaneously contributing to regional decarbonization and sustainability. This issuance was also accepted under the 'Hokugin Eco Private Placement Bond' program for environmentally conscious enterprises.

### Donation to Ishikawa Prefecture Prioritizing regional growth, ARUM has designated Ishikawa Prefecture as the recipient of the donation. The funds will be used for local environmental conservation and the promotion of decarbonization, fulfilling the company's commitment to social responsibility through its business activities.

### About ARUM Inc. ARUM develops and manufactures the 'ARUMCODE' series, AI software that fully automates NC programming for high-mix, low-volume precision part machining, and the 'TTMC' fully automated machining center. With a vision to 'Change the Common Sense of Manufacturing through Manufacturing AI and Complete Automation,' ARUM contributes to industry advancement through expertise in automation, processing, analysis, and AI technology.

### Bond Details - Issuer: ARUM Inc. - Location: 1-61 Tomizu, Kanazawa City, Ishikawa Prefecture - Date of Issue: Friday, May 29, 2026 - Amount: 250 million JPY - Term: 7 years - Underwriter: The Hokuriku Bank, Ltd. (Full amount) - Use of Funds: Working capital