Experience the Cutting Edge of Sensing and Semiconductor Back-end: Smart Sensing 2026 / SEMISOL 2026 to be held June 10-12 at Tokyo Big Sight

The Smart Sensing/SEMISOL Secretariat (JTB Communication Design, Inc., hereinafter JCD) will hold the 'Smart Sensing 2026 / SEMISOL 2026 Semiconductor Back-end Technology & Solution Exhibition' from June 10 (Wed) to 12 (Fri) at Tokyo Big Sight West Hall 3, focusing on sensor technology and semiconductor back-end processes that form the foundation of a data-driven society including AI, IoT, and autonomous driving.

Smart Sensing, held since 2017, is a specialized exhibition for sensing technology. It promotes business expansion for those in the sensor industry and facilitates the social implementation of sensing technology, contributing to data collection, analysis infrastructure, and automation.

SEMISOL is an exhibition that supports Japan's outstanding semiconductor technology and product development capabilities, such as chiplets, 2.5D/3D packaging, manufacturing equipment, and inspection/analysis. Amidst the rapid evolution of AI and the increasing demand for power in data centers, expectations for innovative technologies like AI semiconductors and chiplets are rising. SEMISOL creates opportunities for business expansion and co-creation in the semiconductor industry.

The exhibition comprehensively introduces how innovations in sensors, IoT, and semiconductor packaging are being commercialized and creating business value through cutting-edge displays, case studies, and seminars. It serves as a business platform for cross-industry collaboration, market development, and networking.

Exhibitors include the National Institute of Advanced Industrial Science and Technology (AIST), iFlasco, iCrystal, QuantumCore, Connectec Japan, NGK Spark Plug, MI-6, and Kimoto, showcasing their latest technologies. The event also features a keynote speech by Professor Fumihiro Inoue of Yokohama National University and various seminars on the future of chiplet implementation.