1. Date of Board Resolution: 115/06/03 2. Name: United Microelectronics Corp. 2nd Domestic Unsecured Convertible Bond 3. Shelf registration: No 4. Total issue amount: Up to 4 billion TWD 5. Par value per unit: Tentatively 100,000 TWD 6. Issuance price: Minimum 100% of par value; actual amount based on auction results 7. Maturity: Tentatively 5 years 8. Coupon rate: Tentatively 0% 9. Collateral: N/A 10. Use of proceeds: Purchase of machinery and equipment 11. Underwriting method: Auction for public underwriting 12. Trustee: TBD 13. Underwriter: HungYen Securities Co., Ltd. 14. Guarantor: N/A 15. Payment agent: TBD 16. Authentication agency: N/A 17. Conversion, Put/Call options: To be announced separately after regulatory approval.

Other disclosures: - Bonds will be issued via book-entry system. - Authority for determining issuance date, price, etc., delegated to the Chairman. - Application to be made for OTC listing.

FACT BOX

  • Source: PR Times
  • Category: Funding
  • Dates in source: 115/06/03