1. Date of Board or Shareholders' Meeting Resolution: July 23, 2026

2. Investment Plan Details: To meet explosive downstream market demand, the company will invest in the construction of the Shenzhen Third Campus, producing high-end substrate-like PCBs for AI servers and high-end flexible printed circuits for AI terminals.

3. Estimated Investment Amount: RMB 10 billion

4. Expected Investment Timeline: Project launch expected in July 2026, with completion and commencement of operations by 2032

5. Source of Funds: Self-owned funds and/or raised funds

6. Specific Purpose: To support operational requirements

7. Other Matters to be Disclosed: None

FACT BOX

  • Source: PR Times
  • Category: Funding