AndTech to Hold Semiconductor Cleaning & Wafer-to-Wafer Bonding Zoom Seminar on July 30

On July 30, 2026, AndTech will hold a Zoom seminar titled 'Semiconductor Cleaning Basics and Advanced Cleaning/Drying Technology for 3D Integration and Wafer-to-Wafer Bonding: Challenges and Prospects' from 13:00 to 16:00 JST. Led by Hiroyuki Fukue from SCREEN Semiconductor Solutions, the course will cover wet cleaning/drying fundamentals, technical trends, and issues associated with device miniaturization, 3D integration, and drying defects. The seminar will also discuss cleaning and bonding challenges before and after Wafer-to-Wafer processes. The participation fee is 38,500 yen (including tax), with digital materials distributed to attendees. AndTech provides research and development support services including technical seminars, consulting, and market trend research across chemistry, electronics, and medical devices.