AndTech to Host Seminar on August 28, 2026 (Fri): "Fundamentals of Solder Paste Printing Technology and Practical Strategies for Quality Improvement and Defect Prevention — Learning from Verified Data on Optimization of Metal Masks, Squeegees, and Printing Conditions in SMT Assembly"

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; President and CEO: Masao Tsuchiyama; hereinafter "AndTech") will host an on-site seminar titled "Fundamentals of Solder Paste Printing Technology and Practical Strategies for Quality Improvement and Defect Prevention — Learning from Verified Data on Optimization of Metal Masks, Squeegees, and Printing Conditions in SMT Assembly."

Achieving high-quality solder paste printing requires comprehensive knowledge, as numerous factors—including equipment, solder paste, stencils, squeegees, and substrates—are intricately interconnected.

In SMT assembly, the solder paste printing process is critical to product quality, with multiple interdependent factors such as solder paste, metal stencils, squeegees, substrates, and printing conditions all influencing the outcome. This seminar systematically explains each component's role and its impact on print quality using verified data, enabling participants to acquire practical knowledge essential for reducing printing defects and improving yield.

We are confident that the extensive use of verified data in this seminar will provide clear, detailed explanations to help attendees solve real-world production challenges.

With consistently high satisfaction ratings from past participants, our on-site seminars offer an engaging and enjoyable learning environment. We sincerely invite you to attend.

Live Streaming / Web Seminar Overview

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Theme: "Fundamentals of Solder Paste Printing Technology and Practical Strategies for Quality Improvement and Defect Prevention

— Learning from Verified Data on Optimization of Metal Masks, Squeegees, and Printing Conditions in SMT Assembly"

Date and Time: August 28, 2026 (Fri) 13:30–16:30

Registration Fee: 50,600 JPY (tax included) – printed materials provided

URL: https://andtech.co.jp/seminars/1f17271d-9266-6a46-ad48-064fb9a95405

Venue: Chuo City Industrial Promotion Hall, Tokyo

About AndTech Co., Ltd.

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AndTech provides R&D support services for clients across diverse industries, including chemicals, materials, electronics, automotive, energy, medical devices, food packaging, and construction materials.

We assemble top-tier instructors and offer a wide range of services, starting with technical seminars and workshops, followed by instructor dispatch, publishing, consultant placement, market trend research, business matching, and business development consulting.

By listening closely to our clients, we deliver effective support to help them enter desired new business areas and markets.

https://andtech.co.jp/

List of Technical Seminars by AndTech Co., Ltd.

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We host numerous web-based seminars monthly with leading instructors.

https://andtech.co.jp/seminars/search

List of Publications by AndTech Co., Ltd.

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We publish books on carefully selected, high-demand topics.

https://andtech.co.jp/books

Consulting Services by AndTech Co., Ltd.

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We dispatch highly specialized technical consultants with extensive experience.

https://andtech.co.jp/business-consulting

Inquiries Regarding This Seminar

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Aoki, Public Relations and PR Department AndTech Co., Ltd. Email: [email protected] (please replace ● with @)

Full Seminar Program (Recommended for those interested in detailed content)

【Key Highlights of This Seminar】

High-quality solder paste printing requires comprehensive knowledge due to the complex interplay among numerous factors such as equipment, solder paste, stencils, squeegees, and substrates.

In SMT assembly, the solder paste printing process—critical to final product quality—is influenced by multiple interrelated factors, including solder paste, metal stencils, squeegees, substrates, and printing conditions. This seminar systematically explains each factor's role and its impact on print quality using verified data, enabling participants to acquire practical knowledge essential for reducing printing defects and improving yield.

We are confident that the extensive use of verified data will provide clear, detailed explanations to help attendees solve real-world production challenges.

【Duration】 13:30–16:30

【Instructor】 Mr. Toshiaki Wakabayashi, SP Group, SMT Sales Department, Sales Headquarters, Robotics Business Division, Yamaha Motor Co., Ltd.

【Seminar Objectives】

The solder paste printing process is the most critical step in SMT assembly.

Achieving high-quality solder paste printing requires comprehensive knowledge, as numerous factors—including equipment, solder paste, stencils, squeegees, and substrates—are intricately interconnected.

We are confident that this seminar, which uses extensive verified data to explain these factors in detail, will provide valuable insights to help attendees solve challenges in their own production environments.

【Program】

1. Solder Paste

1-1. Overview

1-2. Solder particles (differences in printability by particle size)

1-3. Viscosity and thixotropic index (differences in printability by viscosity)

1-4. Mixing (differences in printability by mixing conditions)

1-5. Management and storage

2. Metal Stencil

2-1. Overview

2-2. Stencil structure

2-3. Tension (differences in printability by tension level)

2-4. Aperture fabrication methods (explanation of characteristics of each method)

2-5. Aperture wall roughness

2-6. Area aspect ratio (differences in printability by aspect ratio)

2-7. Repellent coating

2-8. Fiducial marks (types and characteristics of mark creation methods)

2-9. Special stencils (e.g., removable stencils, adhesive printing stencils)

2-10. Gerber Data

3. Squeegee

3-1. Overview

3-2. Squeegee shape

3-3. Squeegee material (differences in printability by squeegee material)

3-4. Special squeegees

4. Printed Wiring Board

4-1. Overview

4-2. Copper foil thickness (differences in printability by copper thickness)

4-3. Land dimensions (differences in printability by land size)

4-4. Solder resist specifications (differences in printability by resist specs)

4-5. Solder resist thickness (impact on printability)

4-6. Symbol marks (impact on printability)

4-7. Foreign matter (effectiveness of board cleaners)

4-8. Dimensional changes due to storage conditions (impact of humidity)

5. Printer (Printing Conditions)

5-1. Overview

5-2. Printing mechanism (world's first: complete visualization of paste fill status)

5-3. Relationship between printing conditions and printability (impact on volume ratio)

5-4. Cleaning (differences in printability by cleaning conditions)

5-5. Internal printer temperature (impact on printability)

【Q&A Session】

【Keywords】

Solder paste, metal stencil, squeegee, printing conditions, substrate, printer

【Instructor's Background】

Joined Yamaha Motor and engaged in printer development, followed by 25 years of customer evaluation work.

Specialized exclusively in printers, with comprehensive expertise across the entire printing process.

Extensive speaking experience at events such as JPCA Show PROTEC, the Japan Welding Society, and MUSUBI Exhibition.

Delivered numerous seminars at Yamaha Motor’s private exhibitions both in Japan and overseas.

【Knowledge to Be Gained】

Fundamental knowledge of the entire printing process

Practical knowledge to resolve challenges in solder paste printing:

1) Solder paste and printability

2) Metal stencil and printability

3) Squeegee material and printability

4) Printed wiring board and printability

5) Printing conditions

Inquiries Regarding This Seminar

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Aoki, Public Relations and PR Department AndTech Co., Ltd. Email: [email protected] (please replace ● with @)

* Trademarks and registered trademarks of respective companies are used in this press release.

* The information contained in this press release is current as of the date of announcement and is subject to change without prior notice.

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