August 24 (Mon): Zoom Seminar on "Design of High-Speed Transmission, High-Density Wiring, and Power Quality for Semiconductor Package Substrates ~Substrate Design Technology for Chiplets and Optical-Electrical Convergence~" Scheduled

AndTech Inc. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Toyama, hereinafter referred to as AndTech) will explain "High-Speed Transmission Design" as part of its R&D support.

- What is Package Substrate Design that Influences Semiconductor Performance in the AI Era -

This course is for beginners involved in the electrical design of semiconductor package substrates, and for those involved in development outside of electrical design who want to know the requirements for electrical design.

From 2.xD/3D integration, RDL technology, fine bonding, optical chiplets, high-speed transmission design, UCIe, S-parameters, PDN design, to BSPDN, we will practically organize both signal quality and power quality.

Live Web Seminar Course Outline

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Theme: Design of High-Speed Transmission, High-Density Wiring, and Power Quality for Semiconductor Package Substrates ~Substrate Design Technology for Chiplets and Optical-Electrical Convergence~

Date and Time: August 24, 2026 (Mon) 13:00-17:00

Participation Fee: 55,000 yen (tax included) *Materials will be distributed electronically.

URL: https://andtech.co.jp/seminars/1f175161-9604-6b9e-a8dc-064fb9a95405

Web Distribution Format:

This will be a live streaming seminar using the web conferencing tool "Zoom."

Details will be provided after application.

Seminar Structure

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Lecturer: Daisuke Oshima, Associate Professor, Graduate School of Science and Technology, Chiyosai University of Science and Technology

Specialty: Research on advanced and high-speed design of semiconductor package substrates

All items in the program below (please take a look if you are interested in the details)

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【Lecture Highlights】

We will explain the concepts of signal integrity (SI) and power integrity (PI) design, as well as UCIe and PDN design that support high-speed transmission.

【Program】

1. Cutting-edge Semiconductors and Chiplets

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1.1 Miniaturization and High Integration

1.2 Multi-Chip Modules and Chiplets

1.3 Necessity of Chiplets

1.4 Necessity of Optical-Electrical Convergence

1.5 Mass Production of Few Products and Small-Lot Production of Many Products

1.6 DFM and MFD

2. Semiconductor Package Substrates for Chiplets and Optical-Electrical Convergence

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2.1 2.xD Integration Technology

2.2 3D Integration Technology

2.3 Optical-Electrical Convergence Technology

2.4 High-Speed Transmission Design and Simulation Technology

3. Mounting Technology for High-Density Wiring

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3.1 Design Rules and Fan-out Wiring

3.2 Re-distribution Layer (RDL) Technology

3.3 Fine Bonding Technology

3.4 Optical Chiplet Technology

4. Signal Integrity of Semiconductor Package Substrates

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4.1 Resistance, Inductance, Capacitance, and Impedance

4.2 Signal Incidence and Reflection

4.3 Signal Lines and Optical Waveguides

4.4 Characteristic Impedance of Signal Lines

4.5 Transmission Modes of Signal Lines and Optical Waveguides

4.6 Influence of Dielectric Material's Dk and Df on High-Frequency Characteristics

4.7 Miniaturization of Wiring and Characteristic Impedance

4.8 Single-Ended Transmission and Differential Transmission

4.9 Concept and Interpretation of S-parameters

4.10 Crosstalk and Suppression Techniques

4.11 Concept and Interpretation of Eye Patterns

4.12 High-Speed Signal Transmission Using Multi-Level Modulation Technology

4.13 Industry Standard UCIe (Universal Chiplet Interconnect Express) for High-Speed Signal Transmission for Chiplets

5. Power Integrity of Semiconductor Package Substrates

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5.1 Concept of Power Delivery Network (PDN) Impedance and Equivalent Circuit Extraction by Simulation

5.2 PDN Impedance Reduction Measures

5.3 Relationship Between Number of Wiring Layers, Wiring Layer Thickness, and PDN Impedance

5.4 Concept of Back Side Power Delivery Network (BSPDN)

About AndTech Inc.

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We provide R&D support services that offer information for clients engaged in R&D in a wide range of fields, including chemicals, materials, electronics, automotive, energy, medical devices, food packaging, and building materials.

We have a lineup of top-class lecturers and offer various services, starting with "Technical Training Courses/Seminars," followed by "Lecturer Dispatch," "Publishing," "Consultant Dispatch," "Market Trend Surveys," "Business Matching," and "Business Development Consulting."

We listen to our clients' voices and provide effective support for them to advance into desired new business areas and markets.

https://andtech.co.jp/

AndTech Inc. Technical Training Course List

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We hold numerous monthly web lectures and seminars by top-class instructors.

https://andtech.co.jp/seminars/search

AndTech Inc. Book List

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We select highly demanded themes from carefully chosen topics and publish books.

https://andtech.co.jp/books

AndTech Inc. Consulting Services

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We dispatch highly specialized technical consultants with extensive experience and achievements.

https://andtech.co.jp/business-consulting

Inquiries Regarding This Matter

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AndTech Inc. Public Relations Representative: Aoki

Email Address: pr●andtech.co.jp (Please replace ● with @ and contact us)

* Product and service names mentioned in this press release are trademarks or registered trademarks of their respective companies.

* The content described in this press release is current as of the date of announcement. It may be changed without notice thereafter.

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