AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture, President: Masao Toyama, hereinafter AndTech) will hold a course on "Semiconductor Packages" and "Glass Core Substrates (TGV)".

- Why Glass Core Substrates Now? Exploring the Evolution of Semiconductor Packages in the AI Era -

This seminar will cover the trends in semiconductor packaging and the key points of glass core substrate design, implementation, and reliability evaluation. Furthermore, it will introduce the technical challenges and future prospects of next-generation package substrates through TGV design, formation technology using sintered Cu paste, and application examples for large AI server packages.

Live Streaming Web Seminar Overview

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Theme: Glass Core Substrate Design, High-Speed Transmission, Reliability Evaluation, and TGV Manufacturing Technology - Large-Area AI Server Package Design and Latest Sintered Cu Paste Technology -

Date and Time: August 28, 2026 (Fri) 10:30 - 15:10

Participation Fee: 60,500 yen (tax included) *Materials will be distributed electronically.

URL: https://andtech.co.jp/seminars/1f16e194-061d-6c52-b41b-064fb9a95405

https://andtech.co.jp/seminars/1f16e194-061d-6c52-b41b-064fb9a95405

This will be a live streaming seminar using the web conferencing tool "Zoom".

Details will be provided after registration.

Seminar Content Structure

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Lecture 1: 10:30-12:00 (Mr. Tadashi Kamewada, AZ Supply Chain Solutions)

"Technical Trends, Materials, Processing Technologies, Challenges, and Prospects of Glass Core Substrates in Semiconductor Packages"

Lecture 2: 13:00-14:00 (Mr. Satoru Kuramochi, Dai Nippon Printing Co., Ltd.)

"Design, Development, Large-Area Scaling, Reliability Evaluation, and Implementation Challenges of Glass Core Substrates"

Lecture 3: 14:10-15:10 (Mr. Yoshinori Ejiri, Resonac Holdings Corporation)

"Application of Sintered Cu Paste to TGV (Glass Core Substrate)"

Knowledge to be Gained and Technical Issues to be Solved in This Seminar

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1 Advantages and Challenges of Glass Substrates

2 Development Status and Supply Chain of Major Players

3 Basic Principles of TGV Design and Current Capacity Design Methods

4 Latest Technical Trends in AI Server Packages

5 Implementation Challenges in Large-Area Panel Manufacturing

All items in the program below (please view if you are interested in the details)

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Part 1: Technical Trends, Materials, Processing Technologies, Challenges, and Prospects of Glass Core Substrates in Semiconductor Packages

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AZ Supply Chain Solutions

Business Consulting

Tadashi Kamewada

[Lecture Summary]

Able to objectively discuss the global semiconductor landscape and Japan's position from an American perspective, having managed the supply chain of the world's leading semiconductor manufacturers from the US for over 25 years.

[Program]

1. Introduction (Scope of the lecture)

2. Semiconductor Substrate Market Trends

3. Advantages of Glass

4. Challenges of Glass

5. Major Players and Supply Chain

6. Future Development Forecasts

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Part 2: Design, Development, Large-Area Scaling, Reliability Evaluation, and Implementation Challenges of Glass Core Substrates

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Dai Nippon Printing Co., Ltd.

Fellow, Fine Packaging Division

Satoru Kuramochi

[Lecture Summary]

This lecture will systematically explain the large-area AI server package structure using glass core substrates, high-density power supply design using TGV, high-reliability technology using inorganic film RDL, and high-speed transmission design between XPU-CPO, incorporating simulation and experimental data.

[Program]

1. AI Server Market and Technical Background

1.1 Evolution of AI Data Servers and Power Challenges

1.2 Expansion of XPU + HBM Chiplet Configurations

1.3 Reasons for the Necessity of CPO Integration

1.4 Future Predictions for Package Size Expansion

2. Large Packages and Warpage Control

2.1 Structural Challenges of 200mm-class Packages

2.2 Limitations of Organic Core Substrates

2.3 Material Properties of Glass Core Substrates

2.4 Impact of CTE and Elastic Modulus on Warpage

2.5 JEITA Warpage Standards and Design Margins

2.6 Warpage Simulation Methods

3. Power Supply and TGV Design

3.1 Semiconductor Node Evolution and Required Power Density

3.2 Package-Level Power Supply Challenges

3.3 TGV Structure and Current Density Distribution

3.4 Relationship Between Via Cross-sectional Area and Maximum Current

3.5 Design Guidelines for Multi-TGV Structures

3.6 Manufacturing Technology for Fine-Pitch TGV

4. Fine RDL and Reliability Design

4.1 Challenges of 2/2μm-class Fine Wiring

4.2 Relationship Between Wiring Cross-sectional Area and Insertion Loss

4.3 Structure of Inorganic-Coated Cu Wiring

4.4 Electromigration Test Results

4.5 Lifetime Evaluation Using Black's Equation

5. High-Speed Transmission Design (XPU-CPO)

5.1 High-Speed RDL Architecture Design

5.2 Transmission Characteristics in the 70GHz/100GHz Bands

5.3 Key Points for Insertion Loss Reduction Design

5.4 AI Chiplet-CPO Link Design

6. Verification and Reliability Evaluation

6.1 Implementation Verification of 300x400mm Panels

6.2 Prototyping of RDL Structures

6.3 Complete Cu Filling Technology for TGV

6.4 TST and HAST Test Conditions

6.5 SEWARE Occurrence Mechanism

6.6 Effect and Design Importance of Buffer Layers

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Part 3: Application of Sintered Cu Paste to TGV (Glass Core Substrate)

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Resonac Holdings Corporation

Advanced Fusion Research Center, Professional

Yoshinori Ejiri

[Lecture Summary]

This lecture will explain the benefits of applying sintered Cu paste.

[Program]

1. Application Items for Sintered Cu Paste

2. Filling Method of Sintered Cu Paste into Vias

3. Sinterability of Sintered Cu Paste

4. Application of Sintered Cu Paste to TGV

4.1 Sintered Cu Paste vs. Electrolytic Copper Plating

4.2 Filling Capability for High Aspect Ratio Vias

4.3 Fabrication and Reliability Evaluation of TGV Substrates

4.4 Effect of Sintered Cu Paste in Suppressing Glass Cracking

4.5 Method and Equipment for Filling Sintered Cu Paste into 510x515 mm Substrates

About AndTech Co., Ltd.

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We provide R&D support services that offer information for clients engaged in R&D across a wide range of fields, including chemicals, materials, electronics, automotive, energy, medical devices, food packaging, and building materials.

We offer various services, starting with "Technical Training Courses/Seminars," "Lecturer Dispatch," "Publications," "Consultant Dispatch," "Market Trend Surveys," "Business Matching," and "Business Development Consulting," with a lineup of top-tier instructors.

We listen to our clients' needs and provide effective support for them to enter desired new business areas and markets.

https://andtech.co.jp/

AndTech Co., Ltd. Technical Training Course List

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We hold numerous monthly web seminar courses by top-tier instructors.

https://andtech.co.jp/seminars/search

AndTech Co., Ltd. Book List

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We publish books selected from excellent themes that are in high demand.

https://andtech.co.jp/books

AndTech Co., Ltd. Consulting Services

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We dispatch highly specialized technical consultants with extensive experience and achievements.

https://andtech.co.jp/business-consulting

Inquiries Regarding This Matter

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AndTech Co., Ltd. Public Relations Representative Aoki

Email Address: pr●andtech.co.jp (Please replace ● with @ and contact us)

* Product and service names mentioned in this press release are trademarks or registered trademarks of their respective companies.

* The content described in this press release is current as of the date of announcement. It is subject to change without notice.

End

FACT BOX

  • Source: PR TIMES
  • Category: セミナー
  • Organizations: AZ Supply Chain Solutions