WEB Seminar on August 31 (Mon): 'Ultra-Thin and Compact Vapor Chambers (Thin Heat Dissipation Components) for Electronics Cooling – Implementation in Cooling Units, Ultra-Thin Wicks, Chip Cooling for Servers, and Semiconductor MEMS Applications'

AndTech Co., Ltd. (Headquarters: Kawasaki City, Kanagawa Prefecture; President and CEO: Masao Tsuchiyama; hereinafter 'AndTech') will offer a lecture course on 'vapor chambers (thin heat dissipation components)' and their 'development and implementation'.

― The Evolution of High-Performance Cooling with Vapor Chambers, from AI Servers to Compact Electronic Devices ―

This seminar will explain the product development and business expansion of ultra-thin vapor chambers, as well as their implementation into liquid-cooled and air-cooled cooling units for servers.

Additionally, the design of MEMS vapor chambers utilizing semiconductor and precision machining technologies will also be introduced.

Live Webinar Seminar Overview

──────────────────

Theme: Ultra-Thin and Compact Vapor Chambers (Thin Heat Dissipation Components) for Electronics Cooling – Implementation in Cooling Units, Ultra-Thin Wicks, Chip Cooling for Servers, and Semiconductor MEMS Applications

Date and Time: August 31, 2026 (Mon) 13:00–16:30

Participation Fee: 60,500 JPY (tax included) ※ Digital materials will be distributed

URL: https://andtech.co.jp/seminars/1f18013e-fcc2-6db2-ab1f-064fb9a95405

Webinar Format:

This is a live webinar conducted using the web conferencing tool 'Zoom'.

Further details will be provided after registration.

Seminar Program

────────────

Lecture 1: 13:00–13:45 (Mr. Harune Suzuki, Murata Manufacturing Co., Ltd.)

'Product Development and Business Expansion of Wicks for Ultra-Thin Vapor Chambers'

Lecture 2: 14:00–15:15 (Mr. Harutoshi Hagino, Fujikura Ltd.)

'Development of Chip Cooling Units for Servers Using Vapor Chambers'

Lecture 3: 15:30–15:45 (Associate Professor Mizumi Kaneko, Nihon University)

'Development of MEMS Vapor Chambers for Temperature Suppression in Electronic Devices'

Knowledge and Technical Issues Addressed in This Seminar

───────────────────────

① Basic structure of vapor chambers ② Market trends in vapor chambers ③ Design of ultra-thin vapor chambers ④ Chip cooling technology ⑤ MEMS (Micro Electro Mechanical Systems) technology

Full Seminar Program (Recommended for those interested in details)

──────────────────────────────

∽∽───────────────────────∽∽

Part 1: Product Development and Business Expansion of Wicks for Ultra-Thin Vapor Chambers

∽∽───────────────────────∽∽

Murata Manufacturing Co., Ltd.

New Product Commercialization Promotion Department, Thermal Business Promotion Section:

Mr. Harune Suzuki

【Presentation Overview】

An introduction to the design and business deployment of wicks developed by our company for ultra-thin vapor chambers, which are seeing growing market demand.

【Program】

1. Product Development of Wicks for Ultra-Thin VC (Vapor Chamber)

1-1 Background and Development History 1-2 Basic Design of VC and Thickness Trends 1-3 Thin Design of VC 1-4 Performance Verification of Ultra-Thin VC Using Newly Developed Wicks 1-5 Future Development Directions

2. Business Expansion of Wicks for Ultra-Thin VC

2-1 Product Lineup of Wicks for Ultra-Thin VC 2-2 Deployment of Wicks for Ultra-Thin VC in Smartphones 2-3 Adoption Cases of Wicks for Ultra-Thin VC

3. Summary

∽∽───────────────────────∽∽

Part 2: Development of Chip Cooling Units for Servers Using Vapor Chambers

∽∽───────────────────────∽∽

Fujikura Ltd.

Electronic Components & Connector Business Division, Electronic Components Development Department, Thermal Technology Development Group:

Mr. Harutoshi Hagino

【Presentation Overview】

We will explain the design and cooling performance of cooling units using vapor chambers as a technology surpassing conventional units, in response to the increasing heat generation due to recent improvements in chip performance. We will also discuss future server cooling technologies.

【Program】

1. About Vapor Chambers

1.1 Chip Cooling Technology for Servers 1.2 Structure and Principle of Vapor Chambers 1.3 Basic Principles of Vapor Chambers

2. Liquid-Cooled Vapor Chamber Cooling Units

2-1 Overview of Liquid-Cooled Units for Servers 2-2 Performance Evaluation of Liquid-Cooled Units for Servers 2-3 Future Development Directions

3. Air-Cooled Vapor Chamber Cooling Units

3-1 Overview of Air-Cooled Units for Servers 3-2 Performance Evaluation of Air-Cooled Units for Servers 3-3 Future Development Directions

4. Reliability and Future Outlook of Vapor Chambers

4-1 Reliability Requirements and Evaluation Results of Vapor Chambers 4-2 Future Outlook for Server Cooling Units

5. Summary

∽∽───────────────────────∽∽

Part 3: Development of MEMS Vapor Chambers for Temperature Suppression in Electronic Devices

∽∽───────────────────────∽∽

Nihon University

College of Science and Engineering, Department of Precision Mechanics, Kaneko Laboratory, Associate Professor:

Mr. Mizumi Kaneko

【Presentation Overview】

We will introduce miniaturization using MEMS (MicroElectro Mechanical Systems) technology employed in semiconductor manufacturing. We will also explain temperature suppression and evaluation of miniaturized vapor chambers.

【Program】

1. Miniaturization of Electronic Devices

1.1 History of Miniaturization of Electronic Devices 1.2 Packaging Technologies for Miniaturization 1.3 Semiconductor Roadmap 1.4 Semiconductors and Heat Dissipation

2. Heat Dissipation and Cooling Systems for Electronic Components

2.1 Introduction to Heat Dissipation and Cooling Systems 2.1 Peltier Devices 2.2 Heat Pipes 2.3 Vapor Chambers 2.4 Advantages and Challenges of Miniaturization 2.5 Market for Compact Vapor Chambers

3. Examples of MEMS Vapor Chambers

3.1 Compact Devices Using Silicon Micromachining Technology 3.2 MEMS (Micro Electro Mechanical Systems) Technology 3.3 Design of MEMS Vapor Chambers 3.4 Heat Dissipation Experiments 3.5 Challenges and Future Research