[Live Webinar/ZOOM] Seminar on "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing" to be held!

CMC Research (https://cmcre.com/) is hosting a live webinar.

Instructor: Yosuke Hirumuta (Quality and Technology Consultant, Hirumuta Professional Engineer Office) Date and Time: Friday, July 3, 2026, 13:30–16:30

Theme: "Fundamentals of Backend Process, Assembly, and Design in Semiconductor Manufacturing" Learn packaging technology, which determines the performance of AI semiconductors, from the basics. Participants will systematically understand failure cases, evaluation analysis, chiplets, and advanced assembly technologies.

Registration Fees: - General: 44,000 JPY (tax included) - Newsletter Members: 39,600 JPY (tax included) - Academic: 26,400 JPY (tax included)

Seminar Topics: 1. Basics of Semiconductor Packaging (evolution and development) 2. Packaging Processes (representative examples) 3. Technical Key Points of Manufacturing Processes 4. Past Failure Examples

Registration is available on the official CMC Research website.