[New Publication] The Compendium of Low-Dielectric Materials for the Semiconductor and AI Era: A 2035 Strategy Decoded from Implementation, Regulations, and Economic Security

Against the backdrop of rapidly expanding AI infrastructure demand, low-dielectric materials are shifting their positioning from mere electronic materials to "strategic resources for the AI era."

This book comprehensively analyzes key themes such as ultra-high-speed transmission exceeding 224Gbps, co-packaged optics (CPO), chiplet and 3D integration, PFAS regulations, and economic security.

It provides a holistic analysis of the market structure up to 2035 through market forecasts, major company analyses, digital twins, and MI application examples.

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📘 Book Overview

Title: The Compendium of Low-Dielectric Materials for the Semiconductor and AI Era: A 2035 Strategy Decoded from Implementation, Regulations, and Economic Security

Publication Date: June 30, 2026

Format: A4, Softcover, 173 pages

Price: ¥154,000 (including tax) for the print version

Set Price (Book + PDF CD): ¥198,000 (including tax) for the print version + CD (PDF version)

ISBN: 978-4-910581-92-7

Edited and Published by: CMC Research, Inc.

📝 Features of This Book

➢ Technological innovations and market changes in low-dielectric materials supporting the era of ultra-224Gbps transmission!

➢ Supply chain restructuring and material strategies in the geopolitical era!

➢ Future vision of advanced integration driven by optical-electrical convergence and glass core substrates!

➢ Analysis of the 2035 electronic substrate material market decoded with a triple amplification model!

➢ Multi-faceted analysis of the competitive advantages of major material manufacturers!

➢ Technical requirements for low-dielectric materials supporting chiplets and 3D integration!

➢ Growth potential and investment value of the low-dielectric material market looking towards 2035!

◎ On Publication

The electronic materials industry is currently at a historical turning point where multiple megatrends are progressing simultaneously, driven by the rapid expansion of AI infrastructure demand. At the center of this is low-dielectric material. While traditionally positioned as functional materials for high-frequency applications, low-dielectric materials have rapidly increased in strategic importance with the advancement of AI servers, edge computing, physical AI, autonomous driving, and next-generation communication infrastructure.

Especially in the ultra-high-speed transmission domain exceeding 224Gbps, dielectric loss directly constrains system performance. As frequency increases, transmission loss grows non-linearly with material properties, making it increasingly difficult to maintain power consumption, heat dissipation, and signal quality with conventional electrical wiring alone. In this domain, material selection is not merely an optimization at the component level but directly linked to the overall system architecture design. Furthermore, as a complementary solution to the limitations of electrical wiring, in-package optical interconnects and CPO (Co-Packaged Optics) are emerging as practical solutions, making integrated design of polymer optical waveguides and low-dielectric materials indispensable.

Simultaneously, PFAS regulations are fundamentally altering the prerequisites for electronic material development. Fluorine-based materials, which have previously achieved high performance, are facing increasing pressure for substitution due to stricter environmental regulations. This is shifting the paradigm of material development from "performance maximization" to "multi-dimensional optimization assuming regulations, costs, and supply constraints." This change impacts not only material design but also manufacturing processes, yields, cost structures, and the entire supply chain.

Moreover, the growing importance of geopolitical risks and economic security is significantly altering the supply structure of the electronic materials industry. Export controls, particularly in the context of US-China tensions, national semiconductor industry policies, and supply constraints of critical minerals, are making the risk of supply chain fragmentation a reality. Consequently, material manufacturers are compelled to respond to new competitive axes such as "supply continuity," "regional diversification," and "regulatory compliance," in addition to traditional performance and cost competition.

In addition, the costs associated with transmission loss countermeasures and power consumption reduction are rapidly increasing in AI servers and next-generation data centers, moving towards a stage where material properties themselves influence the overall system's power efficiency, thermal design, and TCO (Total Cost of Ownership). In other words, low-dielectric materials are increasingly characterized not just as electronic materials but as strategic resources determining the efficiency of AI-era infrastructure.

This report analyzes these changes not from a single perspective but as a four-layered structure of "Technology," "Regulations," "Market," and "Geopolitics." Specifically, it clarifies the essence of the competitive structure in next-generation electronic materials through market forecasts using a triple amplification model, visualization of transmission loss using digital twins, and advancement of material development using MI (Materials Informatics).

Furthermore, it quantitatively evaluates investment opportunities and business risks towards 2035, considering strategic comparisons of major domestic and international companies, technological trends of startups, progress in cross-industry collaborations, and directions of supply chain reorganization. This report aims to provide practical guidance for material manufacturers, semiconductor companies, integration-related companies, chemical manufacturers, and investment/business strategy departments in understanding the next-generation electronic materials market.

CMC Research, Inc., Research Department

📖 Book Structure and Table of Contents Overview

Part I: Comprehensive Analysis - Paradigm Shift of Megatrends and Low-Dielectric Materials

Chapter 1: Paradigm Shift of Low-Dielectric Materials - Next-Generation Integration Strategy Integrating 224Gbps, PFAS Regulations, and Geopolitical Risks

1. System Architecture and Signal Integrity (SI)

2. Policy Trends and Supply Chain Risk Structure

3. Integration Processes and Yield Risks

4. Market Structure and Revenue Models

5. Technology Readiness Level (TRL) and Adoption Decisions

6. Management Decision-Making Matrix

7. Conclusion: Moving Beyond Material Supply

Chapter 2: Demand Shift for Next-Generation Low-Dielectric Materials - Transition from 5G Infrastructure to AI, Edge, and Physical AI

1. From Communication to Computation, and then to Physical AI

2. Structural Comparison of Material Requirements by Application

3. Technical Specificity of AI Servers Compared to 5G Infrastructure

4. Material Trends in Edge and Physical AI

5. Material Supply Chain Trends and Responses to Regulations

6. Transition to the Multi-Dimensional Optimization Era and "System Material" Competition

Chapter 3: Material and Technology Roadmaps for Next-Generation Applications

1. Data Centers: Integrated Design for 224G/3.2T and CPO

2. Physical AI/Robotics: Machine Reliability-Driven Design

3. 6G/Satellite: TRL Dominated by Mass Production Compatibility

4. Material Resilience: Dual Constraints of Regulations and Reliability

Chapter 4: Market Size Trends and Forecasts (2024-2035) - Structural Analysis of the Electronic Substrate Material Market Using a Triple Amplification Model

1. Market Growth Decomposition Model: Why the Material Market Outperforms the Substrate Market

2. Key Variables Governing the Triple Amplification Structure

3. Triple Amplification Structure Based on "Quantity x Unit Price x Loss"

4. Investment Decision Model: Decomposition of Profit Structure

5. Application Mix and Revenue Structure

6. Substrate Material Market Forecast: From AI Servers to Edge Distribution

7. Low-Dielectric Material Market Forecast: Transition to a Multi-Material Coexistence Structure

8. PFAS Regulations and Scenario Branching

Chapter 5: Four Major Topics Shaking the Industrial Structure - Quantitative Risk and Opportunity Analysis for Investment Decisions

1. AI Servers/HPC: TCO Reversal Point in High-Density Clusters

2. PFAS-Free Alternatives: Multi-Axis Trade-offs and Layered Optimization

3. Carbon Neutrality: Cost Constraints and Regional Disparities

4. MI (Materials Informatics): Scaling Walls

5. Investment Evaluation Framework for 2026-2030

Chapter 6: Technical Requirements and Standardization Trends - Quantifying Design Constraints and Investment Impact

1. Precise Evaluation of Transmission Loss by Frequency and Investment Boundary for Pursuing Df Limits

2. High-Speed Data Transfer Standards and Break-Even Point Between "Retimers vs. High-Value Materials"

3. Thermal Management, CTE, GlassCore: Physical Limits of High-Density Integration

4. Structural Shift in Competitive Evaluation KPIs in the Electronic Materials Market - Integrated Evaluation Metrics for the Era of High-Speed Transmission, Advanced Integration, and PFAS Regulations

Part II: Case Studies - Deep Dive into Integration and Materials

Chapter 1: Substrate Materials - System Resilience and Environmental Compatibility

1. CCL for Multilayer Main Boards (Specialized for AI Servers and Data Centers)

2. CCL for Antenna Boards (for 6G and Physical AI Communication)

3. Low-Dielectric FCCL and Interlayer Dielectric Films (for Wearables and Robotics)

4. Next-Generation Package Substrate Materials (for Chiplets and Optical-Electrical Convergence)

Chapter 2: Low-Dielectric Materials - Balancing High Functionality and Sustainability

1. Epoxy/PPE/Bismaleimide (High Heat Resistance and High Frequency Support)

2. Butadiene/Aromatic Hydrocarbons - Promising Candidates for PFAS-Free Low-Dielectric Materials

3. Fluoropolymers (PTFE, etc.): Regulatory Trends and Maintenance of Ultra-Low Loss Applications

4. Liquid Crystal Polymers (LCP) and Low-Dielectric PI: Responding to Multi-Layering and Thinning Needs

5. Stable Procurement of Functional Fillers (Low-Dielectric Silica, Hollow Microparticles)

6. Low-Dielectric Flame Retardants and Environmentally Friendly Additives

Part III: Featured Manufacturer Development Case Studies - Resilience and Innovation

Chapter 1: Overview of Strategies of Major Domestic Material Manufacturers

1. Competitive Structure of High-Performance Substrate Materials in the Generative AI/HPC Era

2. Detailed Analysis of Individual Company Strategies

3. Integrated Strategy of Resilience and Innovation

4. Conclusion: Advanced Strategy and Sustainable Advantage for AI Substrate Materials

Chapter 2: Global Strategies of Leading Overseas Manufacturers - Redefining Electronic Material Competition Through AI Integration, Specialization, and Geopolitical Realignment

1. Qnity Electronics (formerly DuPont Electronics & Industrial)

2. Rogers Corporation

3. Isola Group

4. Lonza

5. Doosan Corporation Electro-Materials

6. Nanya Plastics

7. 2026 Electronic Materials Market Summary: Transition to an AI Infrastructure Integrated Industry and Key to Adaptation

Chapter 3: Global Comparative Analysis and Competitiveness Evaluation - Structural Advantages of Material Manufacturers from the Perspectives of MI, Geopolitics, and Environmental Response

1. Technological Resilience: Comparative Use of Materials Informatics (MI)

2. Distributed Production System: Structure for Responding to Geopolitical Risks

3. Environmental Responsiveness: Regulatory Compliance and Market Requirements

4. Customer Integration: New Competitive Axis in the AI Server/HBM Era

5. Transformation of the Competitive Structure in the Next-Generation Electronic Materials Market

Part IV: Innovation in Development Through Digital Twins and MI

Chapter 1: Molecular Design of Next-Generation Resins Using MI

1. Walls in MI Resin Development

2. Basic Structure of Molecular Design Based on Pareto Optimization

3. Basic Approaches to Molecule Generation and Search

4. Effects and Limitations of MI Introduction

5. Structural Changes in Next-Generation Resin Design

6. Conclusion: Structural Shift Towards Data-Driven Exploration

Chapter 2: Application of MI in PFAS Alternative Material Development - Predicting Properties of Non-Fluorinated Polymers and Shortening Development Lead Times

1. PFAS Regulation Environment and Technical Background

2. Basic Structure of Non-Fluorinated Material Design Using MI

3. Direction of Non-Fluorinated Polymer Design

4. Role of MI in Alternative Material Design

5. Significance of MI in PFAS Alternative Development

6. Conclusion: Development Strategy for Next-Generation High-Speed Communication Low-Dielectric Materials - Structure of PFAS-Free Transition and Multi-Objective Optimization Using MI

Chapter 3: Digital Twin Modeling of High-Frequency Transmission Loss - Elucidating Loss Factors and Calibration Beyond 224Gbps

1. Physical Challenges in 224Gbps Class Transmission

2. Modeling Methods Using Digital Twins

3. Calibration and Measurement Integration

4. Fundamental Structure of Digital Twins

5. High-Precision Modeling Techniques in Next-Generation High-Speed Transmission Design

Part V: Optical-Electrical Convergence and 3D Packaging Integration

Chapter 1: Low-Dielectric Requirements for Interposer Materials in Chiplet (2.5D/3D) Structures - Material Innovation for High-Density Wiring and Signal Delay Suppression

1. Evolution Structure of Interposer Materials

2. Transmission Characteristics and Low-Dielectric Requirements

3. Coefficient of Thermal Expansion (CTE) and Integration Reliability

4. Evolution Direction of Insulation Materials in 3D Integration

5. Conclusion: Redefining Corporate Value Through Non-Financial Indicators and Technological Innovation in Next-Generation Semiconductor Integration Strategies and Ecosystems

Chapter 2: Integration of Polymer Optical Waveguides and Low-Dielectric Materials in CPO Integration - Breaking Through Electrical Signal Limits and Implementing In-Package Optical Interconnects

1. Basic Requirements of Material Structure in CPO Integration

2. Material Properties of Polymer Optical Waveguides

3. Electrical-Optical Hybrid Substrate Structure

4. Optical Coupling and Integration Accuracy Management

5. Conclusion: Multi-Physics Integrated Design and Material Strategy in CPO (Co-Packaged Optics) Integration

Chapter 3: The Rise of Glass Core Substrates (GCS) - Hybridization with Organic Materials and Future Forecasts

1. Background Requiring GCS: Structural Limitations of Organic Materials

2. Structural Advantages of Glass Core Substrates (GCS)

3. Heterogeneous Material Integration Strategy in Next-Generation Semiconductor Packaging: Technical Essentials of GCS Integration and Redefinition of Functional Material Design by MI

4. Future Forecasts and Market Roadmap (2026-2030)

5. Conclusion: Structural Transformation Brought About by GCS

Part VI: Global Laws and Regulations, and Supply Chain Risks

Chapter 1: EU REACH, US TSCA, Japan Chemical Substances Control Law

1. European Union (EU): Comprehensive PFAS by REACH

2. United States: Phased Containment Centered on TSCA

3. Japan: Regulation of Individual Substances by the Chemical Substances Control Law

Chapter 2: Geopolitical Risks of Critical Minerals and Raw Materials

1. Fluorspar and Fluorochemical Supply Chain: Reality of China's Dependency Structure

2. Economic Security Policies and Strategic Independence

3. Circular Economy and PFAS Management

Chapter 3: Act on Promotion of Economic Security and Trends in Domestic Return of Semiconductors and Electronic Materials

1. Act on Promotion of Economic Security and Specified Critical Materials

2. Domestic Return of Semiconductor and Electronic Material Industries

3. Integrated Management Required for Legal and Purchasing Departments

Part VII: Investment and Alliance Strategies

Chapter 1: Funding Trends and Technology Partnership Map for Low-Dielectric Material Startups

1. Market Background: Simultaneous Progression of High Frequency and Environmental Regulations

2. Structure of Startup Funding

3. Technology Partnerships and Integration Ecosystem

Chapter 2: Vertical Integration Through Cross-Industry Collaboration (Chemical x IT x Device Manufacturers)

1. Inevitability of Supply Chain Restructuring

2. "Chemical x IT x Device" Three-Party Model

3. Vertical Integration Achievements by Integration Area

4. Key Issues for Management Planning and Investors

5. Conclusion: Six Key Evaluation Indicators and Structural Transformation

Chapter 3: Calculation of Investment Value Towards 2035 - Potential and ROI Analysis of the Low-Dielectric Material Market

1. Market Growth Drivers Towards 2035

2. Quantitative Investment Evaluation and ROI Analysis

3. Evaluation by rNPV (Risk-Adjusted Net Present Value)

4. Recommendations for Management Planning and Investors

5. Conclusion: Market Outlook and Evolution of Competitive Axes for Low-Dielectric Materials Towards 2035

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※Detailed table of contents can be viewed from the link below.

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