IC design firm VIA announced today that its next-generation AI dashcam platform, Mobile360 D800, will feature MediaTek's (2454) Genio IoT chip platform, with the collaboration to be showcased at COMPUTEX 2026. Chen Pao-hui, Vice President of VIA's VIA Intelligent Automotive Division, stated that through deep cooperation with MediaTek, they hope to help global customers and system integrators overcome development barriers under a standardized architecture, enabling rapid AI deployment and commercialization. VIA stated that the Mobile360 D800, equipped with an 8-core Genio 520 processor integrating an 8th-generation NPU, will provide high-precision edge computing power for automotive terminals. In addition to lane departure warnings and driver fatigue detection, it features high-performance infrared LEDs, ensuring clear visibility even in lightless vehicle interiors.

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  • Source: CNA (Central News Agency)
  • Category: tech