Rapidus Plans European Expansion, to Partner with UK and Italy on Chip R&D

(Central News Agency, Tokyo, 10th – Comprehensive Foreign News) The Yomiuri Shimbun reported today, citing several sources, that Japanese chipmaker Rapidus will sign memorandums of understanding (MOUs) on semiconductor R&D with public sector organizations in the UK and Italy, coinciding with Japanese Prime Minister Shigeru Ishiba's visit to both countries starting on the 13th.

According to sources, Rapidus President Atsuyoshi Koike and others are expected to visit the Prime Minister's Office tomorrow to brief Ishiba on the matter. Ishiba, who views semiconductors as a key growth strategy, is also expected to express full support for the initiative.

Rapidus plans to exchange MOUs with the UK Semiconductor Centre, which is backed by UK government funding, and Italy's government research institute, Chips-IT. The agreements are expected to cover joint R&D of semiconductor manufacturing technology and the granting of access to technical information.

Rapidus is currently expanding its customer base, primarily in the United States. The report analyzes that since these two institutions have strong ties with private companies, Rapidus hopes to expand its sales channels through collaboration with them.

The Yomiuri Shimbun also analyzed that the Japan-UK-Italy cooperation holds significant importance for economic security. Japan's domestic semiconductor supply relies heavily on Taiwan, the US, and South Korea. Rapidus plans to produce advanced logic chips to help reduce Japan's dependence on Taiwan.

Rapidus, heavily funded by the Japanese government and private companies, aims to start mass-producing chips at its factory in Hokkaido from the 2027 fiscal year. (Editor: Yang Weijing) 1150610