Hui Sheng targets advanced packaging and glass substrate equipment, Futu-Tech eyes low-altitude vehicles

(CNA Taipei, July 8) Plasma equipment R&D and manufacturing company Hui Sheng Technology announced today that its performance is expected to be strong in the second half of the year. In particular, IC substrate, especially ABF substrate equipment, continues to benefit from demand driven by artificial intelligence (AI) applications. Semiconductor wafer manufacturing equipment is expected to grow in 2027, and the company continues to invest in advanced packaging, IC substrates, and glass substrate process equipment.

Motor manufacturing and system integration provider Futu-Tech stated that commercial electric vehicle application products are expected to begin small-batch production and shipments in the fourth quarter, with mass production anticipated in 2027. Performance from the miniaturized products business segment is expected to continue to increase, with shipments for low-altitude vehicle applications looking promising.

The Taiwan Venture Capital and Private Equity Association Annual Meeting held a special investor conference session at the Taiwan Stock Exchange today. Hui Sheng, an invited participant, stated that it continues to invest in advanced semiconductor process equipment for high-end applications such as Fan-Out Panel Level Packaging (FOPLP), Wafer Level Packaging (WLP), IC substrates, and glass substrates.

According to information, Hui Sheng's core business focuses on plasma cleaning, plasma etching, and plasma surface modification technologies. It possesses technology platforms spanning vacuum plasma, atmospheric pressure plasma, and high-efficiency plasma flames, applicable to processes such as cleaning, etching, residue removal, polarization, pre-coating treatment, and high-temperature pyrolysis.

Futu-Tech explained that its miniaturized business segment focuses on the development of high-precision and lightweight motor products, targeting applications such as drones and other low-altitude vehicles, robotic dogs, and low-Earth orbit satellites. Futu-Tech has already developed various low-altitude vehicle motor applications and has received orders from European and American customers, with Taiwanese companies continuing to submit samples for testing.

Looking ahead to growth drivers in the second half of the year, Futu-Tech stated that it continues to expand its IE4/IE5 high-efficiency motor product line. Electric bus application products are expected to enter small-batch production in the second half of the year, and robotic dog 2.0 joint modules are expected to enter small-batch production. Upper body joint modules for humanoid robots are expected to be available for customer selection, and aerospace-grade motors will continue to be shipped. (Editor: Yang Lan-hsuan) 1150708

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