(CNA reporter Chung Jung-feng, Taipei, June 13) Taiwan Semiconductor Manufacturing Company (TSMC) announced its self-reported June revenue of NT$442.68 billion today, representing a 6.2% increase from the previous month and a 67.9% year-over-year growth, setting a new record for monthly revenue. Second-quarter revenue reached NT$1.27 trillion, up nearly 12% from the first quarter's NT$1.1341 trillion, exceeding operational targets and achieving a record high for quarterly revenue.
TSMC's June revenue of NT$442.68 billion surpassed the previous monthly record of NT$416.975 billion set in May, with a 6.2% monthly growth and a 67.9% increase compared to NT$263.709 billion in the same period of 2025. Cumulative revenue for the first six months reached NT$2.404484 trillion, up 35.6% from NT$1.773046 trillion in the same period last year.
TSMC had previously projected strong demand for its leading-edge process technologies, forecasting second-quarter revenue to reach between USD 39 billion and USD 40.2 billion, a 10% quarterly increase and a 32% year-over-year growth, based on an assumed average exchange rate of approximately NT$31.7 per USD during the quarter.
Combined revenue for April and May amounted to NT$827.7 billion. With this performance, TSMC's second-quarter operational target has been exceeded, with quarterly revenue surpassing NT$1.27 trillion and setting a new historical high.
Benefiting from robust demand related to artificial intelligence, computing demand has surged significantly, supporting sustained strong demand for leading-edge process chips. TSMC previously anticipated that its dollar-denominated revenue would grow by more than 30% this year.
TSMC's upcoming earnings conference is scheduled for July 16, drawing significant market attention. Investors and analysts are closely watching TSMC's second-quarter profitability and second-half business outlook, including annual revenue growth targets, capital expenditure plans, progress on U.S. manufacturing facilities, development of sub-2-nanometer advanced process technologies, advancements in advanced packaging technologies such as CoWoS and CoPoS, and the company's latest views on the AI industry outlook—these will all be key focal points.
During the June shareholders' meeting, TSMC Chairman and CEO C.C. Wei emphasized that customer demand continues to grow, and TSMC is expanding production in both the United States and Taiwan. He reaffirmed that Taiwan will remain TSMC's largest production base. Wei stated that semiconductor demand will always exist and that TSMC will maintain its world-leading position in technology development, production efficiency, and customer service. He expressed confidence that the company will continue to grow strongly in the coming years. (Edited by Chang Liang-chih) 1150713
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- Source: CNA (Central News Agency)
- Category: 財務業績
- Products / services: CoWoS / CoPoS